Invention Grant
- Patent Title: Substrate support and substrate processing apparatus
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Application No.: US17701744Application Date: 2022-03-23
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Publication No.: US12300475B2Publication Date: 2025-05-13
- Inventor: Michishige Saito
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: XSENSUS LLP
- Priority: JP2021-048614 20210323
- Main IPC: H01J37/20
- IPC: H01J37/20 ; H01J37/32 ; H01L21/67 ; H01L21/687 ; H01L21/683

Abstract:
There is provided a substrate support comprising: a base; a first flow path that opens on a bottom surface of the base at a central portion of the base; a second flow path that surrounds the first flow path and opens on the bottom surface of the base; at least one third flow path communicating with the first flow path and arranged from the central portion toward an outer peripheral portion of the base; and at least one fourth flow path communicating with the second flow path, arranged from the central portion toward the outer peripheral portion of the base, and communicating with the at least one third flow path at the outer peripheral portion of the base.
Public/Granted literature
- US20220310367A1 SUBSTRATE SUPPORT AND SUBSTRATE PROCESSING APPARATUS Public/Granted day:2022-09-29
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