Invention Grant
- Patent Title: Microelectronic devices with pillars or openings extending through a tiered stack
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Application No.: US18353794Application Date: 2023-07-17
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Publication No.: US12302571B2Publication Date: 2025-05-13
- Inventor: John D. Hopkins , Nancy M. Lomeli , Justin B. Dorhout , Damir Fazil
- Applicant: Lodestar Licensing Group, LLC
- Applicant Address: US IL Evanston
- Assignee: Lodestar Licensing Group, LLC
- Current Assignee: Lodestar Licensing Group, LLC
- Current Assignee Address: US IL Evanston
- Agency: TraskBritt
- Main IPC: H10B43/27
- IPC: H10B43/27 ; H10B41/27 ; H10B41/35 ; H10B41/41 ; H10B43/35 ; H10B43/40

Abstract:
Device, systems, and structures include a stack of vertically-alternating tiers of materials arranged in one or more decks of tiers. A channel opening, in which a channel pillar may be formed, extends through the stack. The pillar includes a “shoulder portion” extending laterally into an “undercut portion” of the channel opening, which undercut portion is defined along at least a lower tier of at least one of the decks of the stack.
Public/Granted literature
- US20230363168A1 MICOELECTRONIC DEVICES WITH PILLARS OR OPENINGS EXTENDING THROUGH A TIERED STACK Public/Granted day:2023-11-09
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