Invention Grant
- Patent Title: Memory device and semiconductor die, and method of fabricating memory device
-
Application No.: US18484466Application Date: 2023-10-11
-
Publication No.: US12302587B2Publication Date: 2025-05-13
- Inventor: Ji-Feng Ying , Jhong-Sheng Wang , Tsann Lin
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- Main IPC: H10B61/00
- IPC: H10B61/00 ; G11C11/16 ; H01F10/32 ; H01F41/32 ; H01L23/522 ; H01L23/528 ; H10N50/01 ; H10N50/80

Abstract:
A memory device including bit lines, auxiliary lines, selectors, and memory cells is provided. The word lines are intersected with the bit lines. The auxiliary lines are disposed between the word lines and the of bit lines. The selectors are inserted between the bit lines and the auxiliary lines. The memory cells are inserted between the word lines and the auxiliary lines.
Public/Granted literature
- US20240040801A1 MEMORY DEVICE AND SEMICONDUCTOR DIE, AND METHOD OF FABRICATING MEMORY DEVICE Public/Granted day:2024-02-01
Information query