Invention Grant
- Patent Title: Semiconductor image-sensing structure
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Application No.: US17813947Application Date: 2022-07-21
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Publication No.: US12302658B2Publication Date: 2025-05-13
- Inventor: Wei-Lin Chen , Yu-Cheng Tsai , Chun-Hao Chou , Kuo-Cheng Lee
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee Address: TW Hsinchu
- Agency: WPAT LAW
- Agent Anthony King
- Main IPC: H10F39/18
- IPC: H10F39/18 ; H10F39/00 ; H10F39/12

Abstract:
A semiconductor image sensing structure includes a semiconductor substrate having a front side and a back side, a pixel sensor disposed in the semiconductor substrate, a transistor disposed over the front side of the semiconductor substrate, and a reflective structure disposed over the front side of the semiconductor substrate. A gate structure of the transistor and the reflective structure include a same material. A top surface of the gate structure of the transistor and a top surface of the reflective structure are aligned with each other.
Public/Granted literature
- US20240030256A1 SEMICONDUCTOR IMAGE-SENSING STRUCTURE Public/Granted day:2024-01-25
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