发明申请
- 专利标题: Copper powder and process for producing copper powder
- 专利标题(中): 铜粉和铜粉生产工艺
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申请号: US09726379申请日: 2000-12-01
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公开(公告)号: US20010002558A1公开(公告)日: 2001-06-07
- 发明人: Kazushi Sano , Yoshihiro Okada , Hiromasa Miyoshi , Yoshiomi Takada
- 申请人: DOWA MINING CO., LTD.
- 申请人地址: null
- 专利权人: DOWA MINING CO., LTD.
- 当前专利权人: DOWA MINING CO., LTD.
- 当前专利权人地址: null
- 优先权: JP11-342435 19991201
- 主分类号: H01G009/00
- IPC分类号: H01G009/00 ; B22F009/00
摘要:
A copper powder is provided that has an average particle diameter in the range of from not less than 0.1 nullm to less than 1.5 nullm, that has a narrow particle size distribution width whose value A defined by Equation (1) below in terms of X25, X50 and X75 defined below is not greater than 1.2, and that forms a pseudo-fused sintered product when held at a temperature of 800null C. under an atmosphere of inert gas at one atmosphere pressure: Anull(X75nullX25)/X50nullnull(1), where X25, X50 and X75 are values of particle diameter X corresponding to Q% null25%, 50% and 75% on a cumulative particle-size curve plotted in an orthogonal coordinate system whose abcissa represents particle diameter X (nullm) and ordinate represents Q% (ratio of particles present of a diameter not greater than the corresponding value of X; expressed in units of vol % of particles). The copper powder is produced by conducting wet reduction of cuprous oxide into metallic copper powder in the presence of ammonia or an ammonium salt. When used to form the terminal electrodes of multi-layer capacitor, it enables the electrodes to form into solid sintered bodies with few pores by sintering at a low temperature.
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