公开(公告)号：US20020117652A1

公开(公告)日：2002-08-29

申请号：US09741089

申请日：2000-12-21

申请人： DOWA MINING CO., LTD.

发明人： Kazushi Sano ,  Yoshihiro Okada ,  Hiromasa Miyoshi ,  Yoshiomi Takada

IPC分类号： H01B001/00

CPC分类号： H01B1/026 ,  H05K1/092

摘要： Silver-dispersed copper powder whose particles have substantially no discrete metallic silver on their surfaces is produced by subjecting a silver-adhered copper powder composed of copper particles having silver adhered to the surfaces thereof to heat treatment in a non-oxidizing atmosphere at a temperature of 150-600null C. A conductive paste using the powder as filler resists migration.

摘要翻译： 其颗粒在其表面上基本上不具有离散的金属银的银分散的铜粉是通过将由其上附着有银的铜颗粒组成的银附着的铜粉末在非氧化性气氛中在温度为 150-600℃。使用粉末作为填料的导电胶抵抗迁移。

公开(公告)号：US20030015062A1

公开(公告)日：2003-01-23

申请号：US10216750

申请日：2002-08-13

申请人： Dowa Mining Co., LTD

发明人： Kazushi Sano ,  Yoshihiro Okada ,  Hiromasa Miyoshi ,  Yoshiomi Takada

IPC分类号： B22F009/24 ,  C22C009/00

CPC分类号： H01G4/0085 ,  B22F9/24

摘要： A copper powder is provided that has an average particle diameter in the range of from not less than 0.1 nullm to less than 1.5 nullm, that has a narrow particle size distribution width whose value A defined by Equation (1) below in terms of X25, X50 and X75 defined below is not greater than 1.2, and that forms a pseudo-fused sintered product when held at a temperature of 800null C. under an atmosphere of inert gas at one atmosphere pressure: Anull(X75nullX25)/X50nullnull(1), where X25, X50 and X75 are values of particle diameter X corresponding to Q %null25%, 50% and 75% on a cumulative particle-size curve plotted in an orthogonal coordinate system whose abcissa represents particle diameter X (nullm) and ordinate represents Q % (ratio of particles present of a diameter not greater than the corresponding value of X; expressed in units of vol % of particles). The copper powder is produced by conducting wet reduction of cuprous oxide into metallic copper powder in the presence of ammonia or an ammonium salt. When used to form the terminal electrodes of multi-layer capacitor, it enables the electrodes to form into solid sintered bodies with few pores by sintering at a low temperature.

摘要翻译： 提供了具有平均粒径在0.1μm以上且小于1.5μm的范围内的铜粉末，其具有窄的粒度分布宽度，其由以下等式（1）定义的值为X25， 下面定义的X50和X75不大于1.2，并且当在一个大气压力的惰性气体气氛下在800℃的温度下保持时形成假熔融烧结产品：<段落lvl =“0”> < 在线式> A =（X75-X25）/ X50（1），其中X25，X50和X75是对应于Q％= 25％，50％的粒径X的值， 在正交坐标系中绘制的累积粒度曲线为75％，其中阿克西标记表示粒径X（母体），纵坐标表示Q％（直径不大于X的对应值的粒子的比例;以单位为单位表示 体积％的颗粒）。 通过在氨或铵盐的存在下将氧化亚铜湿法还原成金属铜粉来制造铜粉末。 当用于形成多层电容器的端子电极时，通过在低温下烧结，能够使电极形成具有少孔的固体烧结体。

公开(公告)号：US20010002558A1

公开(公告)日：2001-06-07

申请号：US09726379

申请日：2000-12-01

申请人： DOWA MINING CO., LTD.

发明人： Kazushi Sano ,  Yoshihiro Okada ,  Hiromasa Miyoshi ,  Yoshiomi Takada

IPC分类号： H01G009/00 ,  B22F009/00

CPC分类号： H01G4/0085 ,  B22F9/24

摘要： A copper powder is provided that has an average particle diameter in the range of from not less than 0.1 nullm to less than 1.5 nullm, that has a narrow particle size distribution width whose value A defined by Equation (1) below in terms of X25, X50 and X75 defined below is not greater than 1.2, and that forms a pseudo-fused sintered product when held at a temperature of 800null C. under an atmosphere of inert gas at one atmosphere pressure: Anull(X75nullX25)/X50nullnull(1), where X25, X50 and X75 are values of particle diameter X corresponding to Q% null25%, 50% and 75% on a cumulative particle-size curve plotted in an orthogonal coordinate system whose abcissa represents particle diameter X (nullm) and ordinate represents Q% (ratio of particles present of a diameter not greater than the corresponding value of X; expressed in units of vol % of particles). The copper powder is produced by conducting wet reduction of cuprous oxide into metallic copper powder in the presence of ammonia or an ammonium salt. When used to form the terminal electrodes of multi-layer capacitor, it enables the electrodes to form into solid sintered bodies with few pores by sintering at a low temperature.

摘要翻译： 提供了具有平均粒径在0.1μm以上且小于1.5μm的范围内的铜粉末，其具有窄的粒度分布宽度，其由以下等式（1）定义的值为X25， 下面定义的X50和X75不大于1.2，并且当在一个大气压力的惰性气体气氛下在800℃的温度下保持时形成假熔融烧结产品：<段落lvl =“0”> < 在线式> A =（X75-X25）/ X50（1），其中X25，X50和X75是对应于Q％= 25％，50％的粒径X的值， 在正交坐标系中绘制的累积粒度曲线为75％，其中阿克西标记表示粒径X（母体），纵坐标表示Q％（直径不大于X的对应值的粒子的比例;以单位为单位表示 体积％的颗粒）。 通过在氨或铵盐的存在下将氧化亚铜湿法还原成金属铜粉来制造铜粉末。 当用于形成多层电容器的端子电极时，通过在低温下烧结，能够使电极形成具有少孔的固体烧结体。

公开(公告)号：US20040026669A1

公开(公告)日：2004-02-12

申请号：US10633556

申请日：2003-08-05

申请人： DOWA MINING CO., LTD.

发明人： Kazushi Sano ,  Yoshihiro Okada ,  Hiromasa Miyoshi ,  Yoshiomi Takada

IPC分类号： H01B001/00

CPC分类号： C09D5/24 ,  B22F1/0014 ,  B22F1/0096 ,  B22F9/24 ,  H01B1/026 ,  H01C7/027 ,  H05K1/095 ,  Y10T428/2982

摘要： Copper particle clusters constituting a powder suitable for making a conductive paste are provided that are individually composed of not fewer than two and not more than 20 unit particles joined through neck portions. A conductive paste made from the powder is excellent in conductivity. A conductive filler for conductive paste is provided that consists essentially of a mixture of copper particle clusters A individually composed of two or more unit particles joined through neck portions and spherical metallic particles B of smaller diameter than the particles A. A conductive paste made from the filler is low in viscosity and excellent in conductivity.

摘要翻译： 提供构成适于制造导电浆料的粉末的铜颗粒簇，其分别由不少于2个且不超过20个通过颈部连接的单位颗粒构成。 由粉末制成的导电膏具有优异的导电性。 提供一种用于导电膏的导电填料，其基本上由单独由两个或更多个通过颈部连接的单元颗粒组成的铜颗粒簇A和直径小于颗粒A的球形金属颗粒B的混合物组成。由 填料粘度低，导电性好。