Invention Application
- Patent Title: SEALING DEVICE AND METHOD USEFUL IN SEMICONDUCTOR PROCESSING APPARATUS FOR BRIDGING MATERIALS HAVING A THERMAL EXPANSION DIFFERENTIAL
- Patent Title (中): 密封装置和方法在半导体加工装置中用于桥接具有热膨胀的材料差异
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Application No.: US08964260Application Date: 1997-11-04
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Publication No.: US20010040029A1Publication Date: 2001-11-15
- Inventor: ROBERT E. DAVENPORT , AVI TEPMAN
- Applicant: donald verplancken
- Applicant Address: null
- Assignee: donald verplancken
- Current Assignee: donald verplancken
- Current Assignee Address: null
- Main IPC: F28F007/00
- IPC: F28F007/00 ; B23K001/00 ; H02B001/00 ; H02H001/00 ; H05F001/00 ; H01H001/00 ; H01G002/00 ; H01T023/00 ; G05D023/00

Abstract:
Apparatus for promoting heat transfer between a first volume (chamber volume) and a second volume (expandable, substrate support platform volume). Specifically, the apparatus comprises: a chamber defining a chamber volume that contains a chamber atmosphere, e.g., a partial vacuum; a substrate support platform that defines an expandable volume that contains a heat transfer medium, e.g., air; and a seal that isolates the chamber volume from the heat transfer medium. The substrate support platform further comprises: a substrate support platen that has a first surface located within the chamber volume and a second surface located within the expandable volume; a housing sealed to the second surface of the substrate support platen; and a expandable member such as a bellows, attached to the housing, to provide for expansion of the expandable volume that is defined by the housing and the bellows. The housing is typically fabricated of metal and the substrate support is typically fabricated of ceramic. The seal forms a hermetic junction between the ceramic substrate support and the metal housing.
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