Invention Application
US20020032989A1 Cerium oxide slurry for polishing, process for preparing the slurry, and process for polishing with the slurry
有权
用于抛光的氧化铈浆料，浆料的制备方法以及用浆料抛光的方法
- Patent Title: Cerium oxide slurry for polishing, process for preparing the slurry, and process for polishing with the slurry
- Patent Title (中): 用于抛光的氧化铈浆料，浆料的制备方法以及用浆料抛光的方法
-
Application No.: US09968846Application Date: 2001-10-03
-
Publication No.: US20020032989A1Publication Date: 2002-03-21
- Inventor: Takanori Kido , Masayuki Sanbayashi , Fumio Tsujino , Kagetaka Ichikawa
- Applicant: SHOWA DENKO K.K.
- Applicant Address: null
- Assignee: SHOWA DENKO K.K.
- Current Assignee: SHOWA DENKO K.K.
- Current Assignee Address: null
- Priority: JP10-362707 19981221; JP11-331107 19991122
- Main IPC: C09C001/68
- IPC: C09C001/68 ; C09K003/14
Abstract:
A cerium oxide slurry for polishing comprising cerium oxide dispersed in water, wherein the slurry has a conductivity of about 30c nullS/cm or less when the cerium oxide concentration in the slurry is c wt.%. In order to adjust the conductivity to about 30c nullS/cm or less, cerium oxide is washed with deionized water.
Public/Granted literature
Information query
