Invention Application
- Patent Title: Methods of forming microstructure devices
- Patent Title (中): 形成微结构器件的方法
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Application No.: US09850923Application Date: 2001-05-07
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Publication No.: US20020164879A1Publication Date: 2002-11-07
- Inventor: Toi Yue Becky Leung , Jeffrey D. Chinn
- Applicant: Applied Materials, Inc.
- Applicant Address: null
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: null
- Main IPC: H01L021/302
- IPC: H01L021/302 ; H01L021/461 ; H01L021/31 ; H01L021/469
Abstract:
The invention includes methods of forming microstructure devices. In an exemplary method, a substrate is provided which includes a first material and a second material. At least one of the first and second materials is exposed to vapor-phase alkylsilane-containing molecules to form a coating over the at least one of the first and second materials.
Public/Granted literature
- US06576489B2 Methods of forming microstructure devices Public/Granted day:2003-06-10
Information query
