Invention Application
US20030013219A1 Structure and method for fabricating semiconductor structures and devices utilizing electro-optic structures
审中-公开
用于制造使用电光结构的半导体结构和器件的结构和方法
- Patent Title: Structure and method for fabricating semiconductor structures and devices utilizing electro-optic structures
- Patent Title (中): 用于制造使用电光结构的半导体结构和器件的结构和方法
-
Application No.: US09903743Application Date: 2001-07-13
-
Publication No.: US20030013219A1Publication Date: 2003-01-16
- Inventor: Aroon V. Tungare , George T. Valliath , Daniel R. Gamota
- Applicant: MOTOROLA, INC.
- Applicant Address: IL Schaumburg
- Assignee: MOTOROLA, INC.
- Current Assignee: MOTOROLA, INC.
- Current Assignee Address: IL Schaumburg
- Main IPC: H01L021/00
- IPC: H01L021/00 ; H01L027/15 ; H01L031/062 ; H01L033/00 ; H01L031/12

Abstract:
High quality epitaxial layers of monocrystalline materials can be grown overlying monocrystalline substrates such as large silicon wafers by forming a compliant substrate for growing the monocrystalline layers. An accommodating buffer layer comprises a layer of monocrystalline oxide spaced apart from a silicon wafer by an amorphous interface layer of silicon oxide. The amorphous interface layer dissipates strain and permits the growth of a high quality monocrystalline oxide accommodating buffer layer. The accommodating buffer layer is lattice matched to both the underlying silicon wafer and the overlying monocrystalline material layer. Any lattice mismatch between the accommodating buffer layer and the underlying silicon substrate is taken care of by the amorphous interface layer. Electro-optic structures may be integrally provided with such semiconductor structures, which semiconductor structures may also include light-emitting devices and control circuitry.
Information query