Invention Application
- Patent Title: Successive integration of multiple devices process and product
- Patent Title (中): 多设备流程和产品的连续整合
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Application No.: US09896665Application Date: 2001-06-29
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Publication No.: US20030015572A1Publication Date: 2003-01-23
- Inventor: Tom Faska , Richard Stack
- Main IPC: B23K035/24
- IPC: B23K035/24 ; B23K001/00 ; B23K031/02
Abstract:
A device integration method involves attaching two components together using a first material having a first melting point, then creating a unit by attaching the two components to a third component, using a second material having a second melting point lower than the first melting point, and then attaching the unit to another component, using a third material, having a third melting point lower than the second melting point. A device having multiple components attached together using a process described herein.
Information query
