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    Successive integration of multiple devices process and product
    3.
    发明申请
    Successive integration of multiple devices process and product 审中-公开
    多设备流程和产品的连续整合

    公开(公告)号：US20030015572A1

    公开(公告)日：2003-01-23

    申请号：US09896665

    申请日：2001-06-29

    发明人： Tom Faska ,  Richard Stack

    IPC分类号： B23K035/24 ,  B23K001/00 ,  B23K031/02

    CPC分类号： H05K3/3463 ,  B23K35/262 ,  B23K35/268 ,  B23K35/3013 ,  G02B6/43 ,  H01L25/50 ,  H01L2224/16

    摘要： A device integration method involves attaching two components together using a first material having a first melting point, then creating a unit by attaching the two components to a third component, using a second material having a second melting point lower than the first melting point, and then attaching the unit to another component, using a third material, having a third melting point lower than the second melting point. A device having multiple components attached together using a process described herein.

    摘要翻译： 装置集成方法包括使用具有第一熔点的第一材料将两个部件连接在一起，然后通过使用具有低于第一熔点的第二熔点的第二材料将两个部件附接到第三部件来产生单元，以及 然后使用具有低于第二熔点的第三熔点的第三材料将该单元附着到另一部件上。 使用本文所述的方法将具有多个部件连接在一起的装置。

    Method of applying braze materials to a substrate
    4.
    发明申请
    Method of applying braze materials to a substrate 有权
    将钎焊材料施加到基材上的方法

    公开(公告)号：US20020153405A1

    公开(公告)日：2002-10-24

    申请号：US09791951

    申请日：2001-02-22

    申请人： HICKMAN INDUSTRIES, INC.

    发明人： Hans Van Esch

    IPC分类号： B23K031/02 ,  B23K035/24 ,  B23K035/12

    CPC分类号： B23P6/007 ,  B23K1/0018 ,  B23K35/0244 ,  B23K35/383 ,  B23K2101/001 ,  C23C4/067 ,  C23C4/073 ,  C23C4/18 ,  F01D5/005 ,  F01D5/288 ,  Y10T29/49318

    摘要： A HVOF process is used for applying brazing materials to repair surfaces of a substrate such as a turbine blade. The brazing material is applied in powdered form and is free of binders and adhesives. The brazing materials may be any one or more of a nickel based, cobalt based or ferrous based high temperature brazing material. Alloys of these elements may be used together with a temperature depressing melting point element such as boron or silicon.

    摘要翻译： HVOF工艺用于施加钎焊材料以修复诸如涡轮叶片的基底的表面。 钎焊材料以粉末形式施加，并且不含粘合剂和粘合剂。 钎焊材料可以是镍基，钴基或亚铁基高温钎焊材料中的任何一种或多种。 这些元素的合金可与降温熔点元素如硼或硅一起使用。

    Low temperature solder column attach by injection molded solder and structure formed
    5.
    发明申请
    Low temperature solder column attach by injection molded solder and structure formed 审中-公开
    低温焊料柱通过注塑焊料附着并形成结构

    公开(公告)号：US20020023945A1

    公开(公告)日：2002-02-28

    申请号：US09862371

    申请日：2001-05-22

    申请人： International Business Machines Corporation

    发明人： Peter A. Gruber ,  Lannie R. Bolde ,  Guy P. Brouillette ,  James H. Covell ,  David Danovitch ,  Chon C. Lei

    IPC分类号： B23K031/02 ,  B23K035/24 ,  B23K035/14 ,  B05D001/32 ,  B05D005/12

    CPC分类号： H05K3/3468 ,  B23K3/0638 ,  B23K35/0222 ,  B23K2101/40 ,  H01L21/4846 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/0415 ,  H05K2203/074 ,  H05K2203/128

    摘要： A method for joining a multiplicity of multi-alloy solder columns to an electronic substrate and the structure formed by such method are disclosed. In the method, a mold plate equipped with a multiplicity of cavities is first filled by an injection molded solder technique with a high temperature solder forming a multiplicity of solder columns. The mold plate is then sandwiched between an extraction plate and a transfer plate by utilizing a multiplicity of displacement means equipped in the extraction plate to displace the multiplicity of solder columns from the mold plate into a multiplicity of apertures equipped in the transfer plate. The multiplicity of cavities in the transfer plate each has a straight opening and a flared opening. The flared opening is then filled with a low temperature solder paste to encapsulate one end of the high temperature solder column. The low temperature solder paste is then reflown on top of a conductive pad on an electronic substrate at a temperature lower than the melting temperature of the high temperature solder to form a bond between the solder column and the conductive pad.

    摘要翻译： 公开了一种将多种多合金焊料柱连接到电子基板的方法以及通过这种方法形成的结构。 在该方法中，首先通过注射成型的焊接技术填充配备有多个空腔的模板，其中高温焊料形成多个焊料柱。 然后通过利用设置在提取板中的多个位移装置将模板夹在提取板和转印板之间，以将多个焊料柱从模板移位成装配在转印板中的多个孔。 传递板中的多个空腔各具有直的开口和扩口的开口。 然后用扩散的开口填充低温焊膏以封装高温焊料柱的一端。 然后在低于高温焊料的熔融温度的温度下，将低温焊膏在电子基板上的导电焊盘的顶部上进行退火，以在焊料柱和导电焊盘之间形成接合。

    Basic flux cored wire with excellent weldability
    7.
    发明申请
    Basic flux cored wire with excellent weldability 失效
    基本药芯焊丝具有优良的焊接性

    公开(公告)号：US20030116550A1

    公开(公告)日：2003-06-26

    申请号：US10235821

    申请日：2002-09-06

    申请人： KISWEL LTD,

    发明人： Sunil Lee

    IPC分类号： B23K035/24

    CPC分类号： B23K35/0266 ,  B23K35/3093 ,  B23K35/3602 ,  B23K35/3607 ,  B23K35/3608 ,  B23K35/361 ,  B23K35/368

    摘要： Disclosed is a basic flux cored wire having a mild steel or an alloy steel sheath filled with flux, characterized in that the flux essentially consists of, with respect to the total weight of the wire: 0.3 to 3.0% Ti and Ti oxide (TiO2-converted value); 1.0 to 2.5% Si and Si oxide (SiO2-converted value); 0.1 to 1.5% Mg and Mg oxide (MgO-converted value); 1.5 to 4.0% Mn and Mn oxide (MnO-converted value); 0.2 to 1.5% Al and Al oxide (Al2O3-converted value); 0.1 to 1.0% Zr and Zr oxide (ZrO2-converted value); 0.2 to 3.5% CaF2; and 0.01 to 0.5% K2O, with the proviso that the components satisfy the basicity of 0.5 to 4.5 in the basicity equation (1) defined as Bnull(CaF2nullMgOnullMnOnullK2O)/(TiO2nullSiO2nullAl2O3nullZrO2). The basic flux cored wire of the present invention is excellent in crack resistance and low temperature toughness, and exhibits excellent welding workability in all welding positions, ensuring an improvement in the efficiency of welding work. Furthermore, the basic flux cored wire according to the present invention exhibits excellent welding workability even under a shield gas of 100% CO2.

    摘要翻译： 公开了一种具有填充有焊剂的软钢或合金钢护套的基本药芯焊丝，其特征在于，所述焊剂基本上由所述焊丝的总重量组成：0.3至3.0％的Ti和Ti氧化物（TiO 2 - 转换价值）; 1.0〜2.5％的Si和Si氧化物（SiO 2转化值）; 0.1〜1.5％Mg和Mg氧化物（MgO转化值）; 1.5〜4.0％Mn和Mn氧化物（MnO转化值）; 0.2〜1.5％的Al和Al氧化物（Al2O3转换值）; 0.1〜1.0％Zr和Zr氧化物（ZrO 2转化值）; 0.2〜3.5％CaF2; 和0.01〜0.5％K2O，条件是在B =（CaF 2 + MgO + MnO + K 2 O）/（TiO 2 + SiO 2 + Al 2 O 3 + ZrO 2）的碱性式（1）中，各成分的碱度为0.5〜4.5， 。 本发明的基本药芯焊丝具有优异的抗裂性和低温韧性，并且在所有焊接位置都具有优异的焊接加工性，确保了焊接加工效率的提高。 此外，本发明的基本药芯焊丝即使在100％CO 2的保护气体下也显示出优异的焊接加工性。

    Bonded niobium silicide and molybdenum silicide composite articles using brazes
    8.
    发明申请
    Bonded niobium silicide and molybdenum silicide composite articles using brazes 有权
    使用铜焊接的硅化铌和硅化钼复合材料

    公开(公告)号：US20020185524A1

    公开(公告)日：2002-12-12

    申请号：US09870430

    申请日：2001-05-30

    申请人： Gerneral Electric Company with cover sheet

    发明人： Ji-Cheng Zhao ,  Melvin Robert Jackson ,  Bernard Patrick Bewlay

    IPC分类号： B23K031/02 ,  B23K035/24 ,  B23K020/22 ,  B23K001/19

    CPC分类号： B23K35/30 ,  B23K1/19 ,  B23K35/32 ,  B23K35/322 ,  B23K35/325 ,  B23K2101/001 ,  B23K2103/08 ,  B23K2103/16 ,  B23K2103/172 ,  F01D5/28 ,  F05D2300/131 ,  Y02T50/672 ,  Y10T428/12639 ,  Y10T428/12674 ,  Y10T428/12778 ,  Y10T428/12806 ,  Y10T428/12819 ,  Y10T428/12826 ,  Y10T428/12847 ,  Y10T428/12861 ,  Y10T428/12868 ,  Y10T428/12875 ,  Y10T428/12889

    摘要： An article, such as an airfoil having a melting temperature of at least about 1500null C. and comprising a first piece and a second piece joined by a braze to the first piece. The first piece comprises one of a first niobium-based refractory metal intermetallic composite and a first molybdenum-based refractory metal intermetallic composite, and the second piece comprises one of a second niobium-based refractory metal intermetallic composite and a second molybdenum-based refractory metal intermetallic composite. The braze joining the first piece to the second piece comprises a first metallic element and a second metallic element, wherein the first metallic element is one of titanium, palladium, zirconium, niobium, and hafnium, and wherein the second metallic element is one of titanium, palladium, zirconium, niobium, hafnium, aluminum, chromium, vanadium, platinum, gold, iron, nickel, and cobalt, the first metallic element being different from the second metallic element. This abstract is submitted in compliance with 37 C.F.R. 1.72(b) with the understanding that it will not be used to interpret or limit the scope of or meaning of the claims.

    摘要翻译： 一种物品，例如具有至少约1500℃的熔融温度的翼型件，并且包括通过钎焊连接到第一件的第一件和第二件。 第一件包括第一铌基难熔金属金属间复合材料和第一钼基难熔金属金属间复合材料之一，第二件包括第二铌基难熔金属金属间复合物和第二钼基难熔金属中的一种 金属间复合材料。 将第一片接合到第二片的钎焊件包括第一金属元件和第二金属元件，其中第一金属元件是钛，钯，锆，铌和铪之一，并且其中第二金属元素是钛 ，钯，锆，铌，铪，铝，铬，钒，铂，金，铁，镍和钴，第一金属元素不同于第二金属元素。 本摘要根据37 C.F.R. 1.72（b），但有一项谅解，即不会用于解释或限制权利要求的范围或含义

    Robust, low-resistance elastomeric conductive polymer interconnect
    9.
    发明申请
    Robust, low-resistance elastomeric conductive polymer interconnect 审中-公开
    坚固耐用的低电阻弹性体导电聚合物互连

    公开(公告)号：US20020086566A1

    公开(公告)日：2002-07-04

    申请号：US10010775

    申请日：2001-12-06

    发明人： Everett F. Simons

    IPC分类号： H01R004/58 ,  B23K001/19 ,  B23K020/16 ,  B23K020/22 ,  B23K035/24 ,  B23K035/36

    CPC分类号： H01R4/04 ,  H01R4/58

    摘要： An elastomeric device for electrically interconnecting two or more components, and a method for making the device. The device comprises an elastomeric matrix having one or more outer surfaces, and one or more electrically conductive pathways through the matrix, wherein at least a portion of the electrical pathway contains a material that is an electrically conductive liquid at the elastomeric device's operating temperature.

    摘要翻译： 用于电连接两个或更多个部件的弹性体装置，以及用于制造该装置的方法。 该装置包括具有一个或多个外表面的弹性体基体，以及穿过该基质的一个或多个导电通路，其中电路径的至少一部分在弹性体装置的工作温度下包含作为导电液体的材料。