发明申请
US20030015709A1 Structure and method for fabricating semiconductor structures, devices, and packaging utilizing the formation of a compliant substrates for materials used to form the same 审中-公开
用于制造半导体结构,器件和包装的结构和方法,其利用形成用于形成它们的材料的柔性衬底的形成

  • 专利标题: Structure and method for fabricating semiconductor structures, devices, and packaging utilizing the formation of a compliant substrates for materials used to form the same
  • 专利标题(中): 用于制造半导体结构,器件和包装的结构和方法,其利用形成用于形成它们的材料的柔性衬底的形成
  • 申请号: US09906138
    申请日: 2001-07-17
  • 公开(公告)号: US20030015709A1
    公开(公告)日: 2003-01-23
  • 发明人: Rudy M. EmrickBruce Allen BoscoStephen Kent RockwellNestor Javier Escalera
  • 申请人: MOTOROLA, INC.
  • 申请人地址: US IL Schaumburg
  • 专利权人: MOTOROLA, INC.
  • 当前专利权人: MOTOROLA, INC.
  • 当前专利权人地址: US IL Schaumburg
  • 主分类号: H01L031/0256
  • IPC分类号: H01L031/0256
Structure and method for fabricating semiconductor structures, devices, and packaging utilizing the formation of a compliant substrates for materials used to form the same
摘要:
High quality epitaxial layers of monocrystalline materials can be grown overlying monocrystalline substrates such as large silicon wafers by forming a compliant substrate for growing the monocrystalline layers. An accommodating buffer layer comprises a layer of monocrystalline oxide spaced apart from the silicon wafer by an amorphous interface layer of silicon oxide. The amorphous interface layer dissipates strain and permits the growth of a high quality monocrystalline oxide accommodating buffer layer. The accommodating buffer layer is lattice matched to both the underlying silicon wafer and the overlying monocrystalline material layer. Any lattice mismatch between the accommodating buffer layer and the underlying silicon substrate is taken care of by the amorphous interface layer. In addition, formation of a compliant substrate may include utilizing surfactant enhanced epitaxy, epitaxial growth of single crystal silicon onto single crystal oxide, and epitaxial growth of Zintl phase materials. A resulting semiconductor structure may then be flip-chip packaged with a suitable substrate.
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