发明申请
US20030085208A1 Method and apparatus for cutting electrical wiring line on a substrate, and method and apparatus for manufacturing electronic device 失效
用于切割基板上的电线的方法和装置,以及用于制造电子装置的方法和装置

  • 专利标题: Method and apparatus for cutting electrical wiring line on a substrate, and method and apparatus for manufacturing electronic device
  • 专利标题(中): 用于切割基板上的电线的方法和装置,以及用于制造电子装置的方法和装置
  • 申请号: US10273422
    申请日: 2002-10-17
  • 公开(公告)号: US20030085208A1
    公开(公告)日: 2003-05-08
  • 发明人: Kazushige UmetsuJun AmakoKenichi Honda
  • 申请人: SEIKO EPSON CORPORATION
  • 申请人地址: null
  • 专利权人: SEIKO EPSON CORPORATION
  • 当前专利权人: SEIKO EPSON CORPORATION
  • 当前专利权人地址: null
  • 优先权: JP2001-325814 20011024; JP2002-257909 20020903
  • 主分类号: B23K026/38
  • IPC分类号: B23K026/38 B23K026/067
Method and apparatus for cutting electrical wiring line on a substrate, and method and apparatus for manufacturing electronic device
摘要:
An apparatus for cutting an electrical wiring line includes a laser generator for generating a laser beam, an optical beam branching element for branching a laser beam generated by the laser generator into a plurality of branch beams, and a condenser element for condensing the branch beams branched by the optical beam branching element (the optical beam branching element can also serve as the condenser element). The condenser element may be a condenser lens which is separate from the optical beam branching element. The power and the focal depth of the branch beam may be adjusted. When the substrate has a transparency to the laser beam, the branch beam is directed to the electrical wiring line formed on the substrate from the opposite side to the surface having the electrical wiring line.
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