公开(公告)号：US20040155018A1

公开(公告)日：2004-08-12

申请号：US10764885

申请日：2004-01-26

Applicant: SEIKO EPSON CORPORATION

Inventor： Kazushige Umetsu ,  Jun Amako ,  Kenichi Honda

IPC: B23K026/38 ,  B23K026/067

CPC classification number: B23K26/0673 ,  B23K26/067 ,  B23K2101/38 ,  G02F1/136204 ,  H05K3/027 ,  H05K3/225

Abstract: An apparatus for cutting an electrical wiring line includes a laser generator for generating a laser beam, an optical beam branching element for branching a laser beam generated by the laser generator into a plurality of branch beams, and a condenser element for condensing the branch beams branched by the optical beam branching element (the optical beam branching element can also serve as the condenser element). The condenser element may be a condenser lens which is separate from the optical beam branching element. The power and the focal depth of the branch beam may be adjusted. When the substrate has a transparency to the laser beam, the branch beam is directed to the electrical wiring line formed on the substrate from the opposite side to the surface having the electrical wiring line.

Abstract translation: 一种用于切割电线的设备包括用于产生激光束的激光发生器，用于将由激光发生器产生的激光束分支成多个分支光束的光束分支元件，以及用于使分支光束分支 通过光束分支元件（光束分支元件也可以用作聚光元件）。 聚光元件可以是与光束分支元件分离的聚光透镜。 可以调整分支光束的光焦度和焦深。 当基板对激光束具有透明度时，分支光束从与具有电布线的表面相反的一侧被引向形成在基板上的电布线。

公开(公告)号：US20040092099A1

公开(公告)日：2004-05-13

申请号：US10698432

申请日：2003-11-03

Applicant: SEIKO EPSON CORPORATION

Inventor： Terunao Hanaoka ,  Kenji Wada ,  Nobuaki Hashimoto ,  Haruki Ito ,  Kazushige Umetsu ,  Fumiaki Matsushima

IPC: H01L021/44 ,  H01L031/112 ,  H01L031/0288 ,  H01L029/80 ,  H01L023/04

CPC classification number: H01L25/0657 ,  H01L21/288 ,  H01L21/76898 ,  H01L23/481 ,  H01L25/50 ,  H01L2224/02381 ,  H01L2224/05001 ,  H01L2224/05011 ,  H01L2224/05022 ,  H01L2224/05027 ,  H01L2224/05556 ,  H01L2224/05567 ,  H01L2224/05572 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06586 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/07811 ,  H01L2924/3025 ,  H01L2924/00

Abstract: A method of manufacturing a semiconductor device comprises a step of forming a through-hole in a semiconductor chip having an electrode and forming a conductive layer on a region comprising an inner side of the through-hole. An intermediate portion of the through-hole is formed to be larger than an edge portion thereof, and the conductive layer is formed by electroless plating.

Abstract translation: 制造半导体器件的方法包括在具有电极的半导体芯片中形成通孔并在包括通孔的内侧的区域上形成导电层的步骤。 通孔的中间部分形成为比其边缘部分大，并且通过无电镀形成导电层。

公开(公告)号：US20030085208A1

公开(公告)日：2003-05-08

申请号：US10273422

申请日：2002-10-17

Applicant: SEIKO EPSON CORPORATION

Inventor： Kazushige Umetsu ,  Jun Amako ,  Kenichi Honda

IPC: B23K026/38 ,  B23K026/067

CPC classification number: B23K26/0673 ,  B23K26/067 ,  B23K2101/38 ,  G02F1/136204 ,  H05K3/027 ,  H05K3/225

Abstract: An apparatus for cutting an electrical wiring line includes a laser generator for generating a laser beam, an optical beam branching element for branching a laser beam generated by the laser generator into a plurality of branch beams, and a condenser element for condensing the branch beams branched by the optical beam branching element (the optical beam branching element can also serve as the condenser element). The condenser element may be a condenser lens which is separate from the optical beam branching element. The power and the focal depth of the branch beam may be adjusted. When the substrate has a transparency to the laser beam, the branch beam is directed to the electrical wiring line formed on the substrate from the opposite side to the surface having the electrical wiring line.

Abstract translation: 一种用于切割电线的设备包括用于产生激光束的激光发生器，用于将由激光发生器产生的激光束分支成多个分支光束的光束分支元件，以及用于使分支光束分支 通过光束分支元件（光束分支元件也可以用作聚光元件）。 聚光元件可以是与光束分支元件分离的聚光透镜。 可以调整分支光束的光焦度和焦深。 当基板对激光束具有透明度时，分支光束从与具有电布线的表面相反的一侧被引向形成在基板上的电布线。

公开(公告)号：US20020151169A1

公开(公告)日：2002-10-17

申请号：US10166703

申请日：2002-06-12

Applicant: Seiko Epson Corporation

Inventor： Kazushige Umetsu ,  Jun Amako ,  Shinichi Yotsuya ,  Katsuji Arakawa

IPC: H01L021/4763

CPC classification number: B23K26/06 ,  B23K26/064 ,  B23K26/0643 ,  B23K26/0648 ,  B23K26/0665 ,  H01L21/486 ,  H01L21/76898 ,  H01L23/481 ,  H01L25/0657 ,  H01L25/50 ,  H01L2223/54453 ,  H01L2224/16 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/00014 ,  H01L2224/0401

Abstract: A semiconductor chip having a vertical current conduction structure of a high reliability: a semiconductor device, a circuit substrate, and an electronic apparatus each containing such semiconductor chips; and a method for producing them. A prehole (3) is formed in a silicon substrate (10) surface-oriented to a (100) face by laser beam irradiation. The prehole (3) is enlarged by anisotropic etching to thereby form a through-hole (4). An electrically insulating film is formed on an inner wall of the through-hole (4). An electrically conducting material is provided inside the insulating film to thereby form a metal bump (30)

Abstract translation: 具有高可靠性的垂直导电结构的半导体芯片：半导体器件，电路基板和各自包含这种半导体芯片的电子设备; 及其制造方法。 在通过激光束照射对（100）面进行表面取向的硅衬底（10）中形成预孔（3）。 通过各向异性蚀刻使预孔（3）扩大，从而形成通孔（4）。 在通孔（4）的内壁上形成电绝缘膜。 在绝缘膜的内部设置导电材料，从而形成金属凸块（30）

公开(公告)号：US20010027633A1

公开(公告)日：2001-10-11

申请号：US09801699

申请日：2001-03-09

Applicant: SEIKO EPSON CORPORATION

Inventor： Jun Amako ,  Kazushige Umetsu ,  Hideo Tanaya

IPC: B65B051/22

CPC classification number: H01L23/10 ,  B65B51/22 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/00

Abstract: According to the present invention, a case housing a product and a lid made of material that transmits a laser beam are fixed to each other with a bonding member interposed between them, and thereafter, a laser beam is focused onto the bonding member through the lid so that the bonding member is melted. By doing so, the case and the lid are welded together via the bonding member.

Abstract translation: 根据本发明，容纳产品和由透射激光束的材料制成的盖子的壳体彼此固定，并且之后，通过盖子将激光束聚焦到接合部件上 使粘接部件熔融。 通过这样做，壳体和盖子通过接合构件焊接在一起。

公开(公告)号：US20010027011A1

公开(公告)日：2001-10-04

申请号：US09765433

申请日：2001-01-22

Applicant: SEIKO EPSON CORPORATION

Inventor： Terunao Hanaoka ,  Kenji Wada ,  Nobuaki Hashimoto ,  Haruki Ito ,  Kazushige Umetsu ,  Fumiaki Matsushima

IPC: H01L021/4763 ,  H01L021/311

CPC classification number: H01L25/0657 ,  H01L21/288 ,  H01L21/76898 ,  H01L23/481 ,  H01L25/50 ,  H01L2224/02381 ,  H01L2224/05001 ,  H01L2224/05011 ,  H01L2224/05022 ,  H01L2224/05027 ,  H01L2224/05556 ,  H01L2224/05567 ,  H01L2224/05572 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06586 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/07811 ,  H01L2924/3025 ,  H01L2924/00

Abstract: A method of manufacturing a semiconductor device comprises a step of forming a through-hole in a semiconductor chip having an electrode and forming a conductive layer on a region comprising an inner side of the through-hole. An intermediate portion of the through-hole is formed to be larger than an edge portion thereof, and the conductive layer is formed by electroless plating.

Abstract translation: 制造半导体器件的方法包括在具有电极的半导体芯片中形成通孔并在包括通孔的内侧的区域上形成导电层的步骤。 通孔的中间部分形成为比其边缘部分大，并且通过无电镀形成导电层。

公开(公告)号：US20020127839A1

公开(公告)日：2002-09-12

申请号：US10077820

申请日：2002-02-20

Applicant: Seiko Epson Corporation

Inventor： Kazushige Umetsu ,  Yohei Kurashima ,  Jun Amako

IPC: H01L021/4763

CPC classification number: H01L21/486 ,  H01L21/76882 ,  H01L21/76898 ,  H01L23/481 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0345 ,  H01L2224/0401 ,  H01L2224/051 ,  H01L2224/05563 ,  H01L2224/05567 ,  H01L2224/0557 ,  H01L2224/05572 ,  H01L2224/056 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/1134 ,  H01L2224/1181 ,  H01L2224/11849 ,  H01L2224/13009 ,  H01L2224/1319 ,  H01L2224/13411 ,  H01L2224/13444 ,  H01L2224/13483 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2224/17181 ,  H01L2224/811 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/814 ,  H01L2224/8149 ,  H01L2224/81815 ,  H01L2224/8185 ,  H01L2224/9202 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/1016 ,  H01L2924/1017 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K3/3494 ,  H05K3/4038 ,  H05K2201/0305 ,  H05K2201/096 ,  H05K2203/041 ,  H05K2203/082 ,  H05K2203/107 ,  H01L2924/0105 ,  H01L2224/05552 ,  H01L2924/00

Abstract: A conductive material is provided to an open end of a penetrating hole penetrating through at least a semiconductor element, on the side of a first surface of the semiconductor element. The conductive material is melted to flow into the penetrating hole. The conductive material is made to flow into the penetrating hole in a state that an atmospheric pressure on the side of a second surface of the semiconductor element opposite to the first surface is lower than an atmospheric pressure on the side of the first surface.

Abstract translation: 在半导体元件的第一表面侧的贯通至少半导体元件的穿透孔的开口端设有导电材料。 导电材料熔化以流入穿透孔。 使导电材料以与第一表面相反的半导体元件的第二表面侧的大气压低于第一表面侧的大气压的状态流入贯通孔。

公开(公告)号：US20020021723A1

公开(公告)日：2002-02-21

申请号：US09919876

申请日：2001-08-02

Applicant: SEIKO EPSON CORPORATION

Inventor： Jun Amako ,  Kazushige Umetsu ,  Hitoshi Nakao

IPC: H01S003/00 ,  G02B027/10 ,  G02B027/44 ,  H01S003/08 ,  H01S003/10

CPC classification number: H01S3/005 ,  B23K26/042 ,  B23K26/0604 ,  B23K26/066 ,  B23K26/0676 ,  G02B27/1086 ,  H01S5/4025

Abstract: The laser processing apparatus includes lasers for emitting a plurality of laser beams of different wavelengths, a common phase grating for splitting the laser beams of different wavelengths into diffraction beams shaped in designed arrays, and a condenser lens for condensing the diffraction beams. The layout of the focused diffraction beam spots of each wavelength is decided in accordance with the design of the phase grating.

Abstract translation: 激光加工装置包括用于发射多个不同波长的激光束的激光器，用于将不同波长的激光束分成衍射光束成形为设计阵列的公共相位光栅，以及用于聚集衍射光束的聚光透镜。 每个波长的聚焦衍射光束斑点的布局根据相位光栅的设计决定。

公开(公告)号：US20020017710A1

公开(公告)日：2002-02-14

申请号：US09902270

申请日：2001-07-11

Applicant: SEIKO EPSON CORPORATION

Inventor： Yohei Kurashima ,  Kazushige Umetsu ,  Haruki Ito

IPC: H01L021/44 ,  H01L021/50

CPC classification number: H01L25/0657 ,  H01L21/76898 ,  H01L23/481 ,  H01L24/11 ,  H01L24/13 ,  H01L24/81 ,  H01L24/83 ,  H01L24/90 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/0557 ,  H01L2224/05576 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/0579 ,  H01L2224/058 ,  H01L2224/11 ,  H01L2224/1134 ,  H01L2224/13 ,  H01L2224/13009 ,  H01L2224/13025 ,  H01L2224/1308 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/16145 ,  H01L2224/16235 ,  H01L2224/81136 ,  H01L2224/81801 ,  H01L2224/90 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06586 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/0002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/351 ,  H01L2224/13099 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/83851 ,  H01L2224/05552 ,  H01L2924/00014

Abstract: A method of manufacturing a semiconductor device includes: a first step of forming a first through hole that penetrates the location of the electrode in a semiconductor element having an electrode; a second step of providing an insulating material in a region including an inside of the first through hole 18, in such a manner that a second through hole is provided penetrating through the insulating material; and a third step of providing a conductive member within the second through hole that penetrates through at least the insulating material in the inside of the first through hole.

Abstract translation: 一种制造半导体器件的方法包括：形成在具有电极的半导体元件中穿过电极位置的第一通孔的第一步骤; 在包括第一通孔18的内部的区域中提供绝缘材料的第二步骤，其中穿过绝缘材料提供第二通孔; 以及第三步骤，在所述第二通孔内设置至少穿过所述第一通孔内部的绝缘材料的导电构件。

公开(公告)号：US20010015589A1

公开(公告)日：2001-08-23

申请号：US09782624

申请日：2001-02-13

Applicant: SEIKO EPSON CORPORATION

Inventor： Eimatsu Sakagami ,  Kazushige Umetsu

IPC: H02K001/06 ,  H02K001/12 ,  H02K015/00

CPC classification number: H02K15/022 ,  H02K1/146 ,  H02K2201/09

Abstract: A laminated core of a motor in which vibrations of core plates causing motor noise is restrained at a low cost; a method of manufacturing such a laminated core; a motor having such a laminated core; and an ink-jet recording apparatus having such a motor. In a laminated core (1) of a motor in which a plurality of core pieces (10) are laminated on each other and which has magnetic poles (13) each having a roughed surface of mountain portions (13a) and groove portions (13b) formed alternately in the direction of rotation of the motor, welded portions (31) for firmly fixing the core pieces (10) to each other are provided in the surface of one of the groove portions (13b) formed in the vicinities of the central portion of each magnetic pole (13) in the direction of rotation. Each welded portion (31) is formed continuously in the direction of lamination of the core pieces (10). Each welded portion (31) is formed by welding the surface of the groove portion (13b). By these welded portions (31), the core pieces (10) are firmly fixed to each other in the surface portions of the magnetic pole portions (13).