发明申请
US20030161069A1 Wafer-level fabrication method for top or side slider bond pads 有权
用于顶部或侧面滑块接合焊盘的晶片级制造方法

Wafer-level fabrication method for top or side slider bond pads
摘要:
A method is used for fabricating sliders for use in a disc drive actuation system, the sliders having bonds pads formed on either a top surface or side faces of the slider. The method comprises providing a substrate having a top surface. Trenches are formed in the substrate and filled with a bond pad material to form slider bond pads. Excess bond pad material is removed from the trenches such that the slider bond pads are flush with the top surface of the substrate. A transducer is fabricated on the top surface of the substrate. Finally, the slider bond pads are exposed.
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