发明申请
US20030161069A1 Wafer-level fabrication method for top or side slider bond pads
有权
用于顶部或侧面滑块接合焊盘的晶片级制造方法
- 专利标题: Wafer-level fabrication method for top or side slider bond pads
- 专利标题(中): 用于顶部或侧面滑块接合焊盘的晶片级制造方法
-
申请号: US10263891申请日: 2002-10-03
-
公开(公告)号: US20030161069A1公开(公告)日: 2003-08-28
- 发明人: Roger L. Hipwell JR. , Wayne A. Bonin , Kyle M. Bartholomew , John R. Pendray , Zine-Eddine Boutaghou
- 申请人: Seagate Technology, LLC
- 申请人地址: CA Scotts Valley
- 专利权人: Seagate Technology, LLC
- 当前专利权人: Seagate Technology, LLC
- 当前专利权人地址: CA Scotts Valley
- 主分类号: G11B005/60
- IPC分类号: G11B005/60
摘要:
A method is used for fabricating sliders for use in a disc drive actuation system, the sliders having bonds pads formed on either a top surface or side faces of the slider. The method comprises providing a substrate having a top surface. Trenches are formed in the substrate and filled with a bond pad material to form slider bond pads. Excess bond pad material is removed from the trenches such that the slider bond pads are flush with the top surface of the substrate. A transducer is fabricated on the top surface of the substrate. Finally, the slider bond pads are exposed.
公开/授权文献
信息查询