公开(公告)号：US20030161069A1

公开(公告)日：2003-08-28

申请号：US10263891

申请日：2002-10-03

申请人： Seagate Technology, LLC

发明人： Roger L. Hipwell JR. ,  Wayne A. Bonin ,  Kyle M. Bartholomew ,  John R. Pendray ,  Zine-Eddine Boutaghou

IPC分类号： G11B005/60

CPC分类号： G11B5/4853 ,  Y10T29/49039 ,  Y10T29/49043 ,  Y10T29/49046 ,  Y10T29/49048 ,  Y10T29/49052 ,  Y10T29/49798

摘要： A method is used for fabricating sliders for use in a disc drive actuation system, the sliders having bonds pads formed on either a top surface or side faces of the slider. The method comprises providing a substrate having a top surface. Trenches are formed in the substrate and filled with a bond pad material to form slider bond pads. Excess bond pad material is removed from the trenches such that the slider bond pads are flush with the top surface of the substrate. A transducer is fabricated on the top surface of the substrate. Finally, the slider bond pads are exposed.

摘要翻译： 一种用于制造用于盘驱动器致动系统的滑块的方法，滑块具有形成在滑块的顶表面或侧面上的接合垫。 该方法包括提供具有顶表面的基底。 在衬底中形成沟槽，并填充有焊​​盘材料以形成滑块接合焊盘。 从沟槽去除过量的接合焊盘材料，使得滑块接合焊盘与衬底的顶表面齐平。 在衬底的顶表面上制造换能器。 最后，滑块接合垫被暴露。