Invention Application
- Patent Title: Polyamide resin composition
- Patent Title (中): 聚酰胺树脂组合物
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Application No.: US10413551Application Date: 2003-04-15
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Publication No.: US20030229162A1Publication Date: 2003-12-11
- Inventor: Hideharu Matsuoka , Hideaki Oka , Koichi Uchida , Masahide Tsuzuki , Koji Beppu
- Applicant: KURARAY CO. LTD. , ASAHI DENKA CO., LTD.
- Applicant Address: JP Okayama JP Tokyo
- Assignee: KURARAY CO. LTD.,ASAHI DENKA CO., LTD.
- Current Assignee: KURARAY CO. LTD.,ASAHI DENKA CO., LTD.
- Current Assignee Address: JP Okayama JP Tokyo
- Priority: JPPAT.2002-112344 20020415
- Main IPC: C08L077/00
- IPC: C08L077/00
Abstract:
A polyamide resin composition contains 100 parts by weight of (A) a polyamide resin with a melting point of 270null C. to 340null C.; 0.2 to 20 parts by weight of (B) a compound represented by Formula (I) 1 where R1 and R2 are alkyl groups having at least 9 carbon atoms, and m and n are integers from 1 to 3; and 1 to 100 parts by weight of (C) a bromine-based flame retardant.
Public/Granted literature
- US06818731B2 Polyamide resin composition Public/Granted day:2004-11-16
Information query
