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    Polyamide and polyolefin blends with a polyamide matrix and containing nanofillers
    1.
    发明申请
    Polyamide and polyolefin blends with a polyamide matrix and containing nanofillers 失效
    聚酰胺和聚烯烃共混物与聚酰胺基质并含有纳米填料

    公开(公告)号：US20040225066A1

    公开(公告)日：2004-11-11

    申请号：US10803008

    申请日：2004-03-17

    Inventor： Jean-Jacques Flat ,  Benoit Barriere ,  Benoit Brule

    IPC: C08L023/00 ,  C08L077/00

    CPC classification number: C08L77/02 ,  B29C37/0075 ,  B32B27/20 ,  B32B27/34 ,  C08L23/0815 ,  C08L23/10 ,  C08L51/06 ,  C08L77/00 ,  C08L77/06 ,  C08L2205/08 ,  C08L2666/20 ,  C08L2666/06 ,  C08L2666/24

    Abstract: The present invention relates to polyamide (A) and polyolefin (B) blends containing nanofillers in which the polyamide forms the matrix. These blends can also be referred to as nullpolyamide (A), polyolefin (B) and nanofiller blends in which the polyamide forms the matrixnull. The invention also relates to compositions with barrier properties which are polyamide (A) and polyolefin (B) blends containing nanofillers in which the polyamide forms the matrix. The invention also relates to structures with barrier properties comprising at least one layer of these blends and optionally at least one layer of another material. The invention also relates to the use of these structures for producing a barrier effect. These structures are a barrier to numerous fluids, and in particular to oxygen, to styrene, to fumigation fluids, to pentane and to air conditioning fluids. These structures can be made into bottles, reservoirs, containers, pipes and vessels of all sorts. They can also be converted to films which are used to make packagings. These films are also useful in food packaging, in SMC technology, in fumigation and in expandable polystyrene packaging. These pipes are useful in air conditioning devices. The invention also relates to the use of these objects.

    Abstract translation: 本发明涉及含有纳米填料的聚酰胺（A）和聚烯烃（B）共混物，其中聚酰胺形成基质。 这些共混物也可以称为“聚酰胺（A），聚烯烃（B）和纳米填料共混物，其中聚酰胺形成基体”）。 本发明还涉及具有阻隔性质的组合物，其是聚酰胺（A）和含有纳米填料的聚烯烃（B）共混物，其中聚酰胺形成基质。 本发明还涉及具有阻挡性质的结构，其包含至少一层这些共混物和任选的至少一层其它材料。 本发明还涉及这些结构用于产生屏障作用的用途。 这些结构是许多流体，特别是氧气，苯乙烯，熏蒸流体，戊烷和空调流体的障碍。 这些结构可以制成各种瓶子，水箱，容器，管道和各种容器。 它们也可以转换成用于制造包装的胶片。 这些膜也可用于食品包装，SMC技术，熏蒸和可扩展聚苯乙烯包装。 这些管道可用于空调设备。 本发明还涉及这些物体的用途。

    Block copolymer, its composition and film made thereof
    3.
    发明申请
    Block copolymer, its composition and film made thereof 有权
    嵌段共聚物，其组成和由其制成的膜

    公开(公告)号：US20040102576A1

    公开(公告)日：2004-05-27

    申请号：US10415662

    申请日：2003-05-08

    Inventor： Masamitsu Matsui ,  Hideki Watanabe ,  Jun Yoshida ,  Hisakazu Hoshino

    IPC: C08L077/00

    CPC classification number: B32B27/08 ,  B32B27/32 ,  B32B2307/736 ,  C08F297/04 ,  C08J5/18 ,  C08J2353/02 ,  C08L25/06 ,  C08L25/14 ,  C08L51/04 ,  C08L53/02 ,  Y10S428/91 ,  Y10T428/31917 ,  Y10T428/3192 ,  Y10T428/31924 ,  Y10T428/31931 ,  C08L2666/24 ,  C08L2666/02 ,  C08L2666/04

    Abstract: It is to provide a block copolymer and its copolymer composition which provides a heat shrinkable (multilayer) film with less spontaneous shrinkage while maintaining favorable low temperature shrinkability, and a heat shrinkable (multilayer) film containing the block copolymer. By using a block copolymer comprising a vinyl aromatic hydrocarbon and a conjugated diene characterized in that the relation of the loss tangent value obtained by dynamic viscoelasticity measurement with the temperature satisfies specific conditions, or a composition containing the copolymer composition as an essential component, a heat shrinkable (multilayer) film with less spontaneous shrinkability and less odor while maintaining favorable low temperature shrinkability can be obtained.

    Abstract translation: 提供一种嵌段共聚物及其共聚物组合物，其提供具有较少自发收缩的热收缩（多层）膜，同时保持有利的低温收缩性，以及含有嵌段共聚物的热收缩（多层）膜。 通过使用包含乙烯基芳族烃和共轭二烯的嵌段共聚物，其特征在于，通过动态粘弹性测量获得的损耗角正切值与温度的关系满足特定条件，或含有共聚物组合物作为必要组分的组合物的热量， 可以获得具有较少自发收缩性和较少气味的可收缩（多层）膜，同时保持有利的低温收缩性。

    Resin composition and process for producing molding
    4.
    发明申请
    Resin composition and process for producing molding 审中-公开
    树脂组合物及其制造方法

    公开(公告)号：US20040102572A1

    公开(公告)日：2004-05-27

    申请号：US10380830

    申请日：2003-08-25

    Inventor： Katsuyoshi Kubo ,  Takahide Otsuka ,  Masahiko Oka ,  Tsuyoshi Miyamori ,  Charles W. Stewart ,  Carolyn Stewart

    IPC: C08J005/00 ,  C08L077/00

    CPC classification number: C08J5/00 ,  C08L27/12 ,  C08L71/00 ,  C08L77/00 ,  C08L77/10 ,  C08L2666/04

    Abstract: The present invention is a resin composition prepared by formulating an engineering plastic with a fluorine-containing polymer wherein said fluorine-containing polymer accounts for 0.005 to 1 mass % of the total of a mass of said engineering plastic and a mass of said fluorine-containing polymer, wherein said fluorine-containing polymer is a perfluoropolymer, and wherein said resin composition is used for extrusion molding or injection molding.

    Abstract translation: 本发明是通过用含氟聚合物配制工程塑料而制备的树脂组合物，其中所述含氟聚合物占所述工程塑料的总质量的0.005〜1质量％，所述含氟聚合物的质量 聚合物，其中所述含氟聚合物是全氟聚合物，并且其中所述树脂组合物用于挤出成型或注射成型。

    Polymeric compositions with enhanced vapour permeability and washability
    5.
    发明申请
    Polymeric compositions with enhanced vapour permeability and washability 审中-公开
    具有增强的透湿性和可洗性的聚合物组合物

    公开(公告)号：US20040063865A1

    公开(公告)日：2004-04-01

    申请号：US10635257

    申请日：2003-08-06

    Applicant: The Procter & Gamble Company

    Inventor： Manuel Mariani ,  Italo Corzani

    IPC: C08L071/02 ,  C08L067/00 ,  C08L077/00

    CPC classification number: A61L15/42 ,  Y10T442/2139

    Abstract: The present invention relates to polymeric compositions for making a liquid impermeable, moisture vapour permeable layer by coating the composition onto a substrate. The polymeric compositions comprise preferred thermoplastic polymers and suitable hydrophilic plasticizers which are covalently bonded to said thermoplastic polymers. The layers made from the polymeric compositions of the present invention exhibit enhanced moisture vapour permeability and washability. These layers can find a variety of applications wherein moisture vapour permeability is desirable for example within waterproof garments, protective bedding covers, and within absorbent articles such as diapers, sanitary napkins, panty liners, incontinence products, protective clothing and the like.

    Abstract translation: 本发明涉及用于通过将组合物涂覆在基材上来制造不透液体的透湿气体的聚合物组合物。 聚合物组合物包含共价键合到所述热塑性聚合物的优选热塑性聚合物和合适的亲水增塑剂。 由本发明的聚合物组合物制成的层表现出增强的透湿性和可洗性。 这些层可以找到各种应用，其中例如在防水衣物，防护性床上用品覆盖物内以及吸收制品例如尿布，卫生巾，内裤衬里，失禁制品，防护服等中都需要透湿性。

    Polyamide resin composition
    6.
    发明申请
    Polyamide resin composition 有权
    聚酰胺树脂组合物

    公开(公告)号：US20030229162A1

    公开(公告)日：2003-12-11

    申请号：US10413551

    申请日：2003-04-15

    Applicant: KURARAY CO. LTD. ,  ASAHI DENKA CO., LTD.

    Inventor： Hideharu Matsuoka ,  Hideaki Oka ,  Koichi Uchida ,  Masahide Tsuzuki ,  Koji Beppu

    IPC: C08L077/00

    CPC classification number: C08K5/103 ,  C08K3/016 ,  C08K5/0066 ,  C08K5/03 ,  C08L77/00 ,  C08L77/02 ,  C08L77/06

    Abstract: A polyamide resin composition contains 100 parts by weight of (A) a polyamide resin with a melting point of 270null C. to 340null C.; 0.2 to 20 parts by weight of (B) a compound represented by Formula (I) 1 where R1 and R2 are alkyl groups having at least 9 carbon atoms, and m and n are integers from 1 to 3; and 1 to 100 parts by weight of (C) a bromine-based flame retardant.

    Abstract translation: 聚酰胺树脂组合物含有（A）熔点为270〜340℃的聚酰胺树脂100重量份。 0.2〜20重量份（B）由式（I）表示的化合物，其中R 1和R 2为具有至少9个碳原子的烷基，m和n为1至3的整数; 和（C）溴系阻燃剂1〜100重量份。

    POLYAMIDE COMPOSITIONS FOR WELDING
    8.
    发明申请
    POLYAMIDE COMPOSITIONS FOR WELDING 审中-公开
    用于焊接的聚酰胺组合物

    公开(公告)号：US20020143117A1

    公开(公告)日：2002-10-03

    申请号：US09486745

    申请日：2000-03-01

    Inventor： MASAHIRO NOZAKI ,  TATSUO KUROE

    IPC: C08L077/00

    CPC classification number: C08L77/00 ,  C08L77/06 ,  C08L77/10

    Abstract: Polyamide compositions for welding are provided, having excellent weldability, heat resistance, and hydrolysis resistance. Compositions of (A) an aromatic polyamide in which the molar fraction of aromatic monomers among the monomer components making up the polyamide is at least 0.2, and (B) an aliphatic polyamide, wherein the weight ratio of (A) and (B) is from 99:1 to 5:95 are described.

    Abstract translation: 提供了用于焊接的聚酰胺组合物，具有优异的可焊性，耐热性和耐水解性。 （A）芳香族聚酰胺的组合物，其中构成聚酰胺的单体成分中的芳香族单体的摩尔分数为0.2以上，（B）脂肪族聚酰胺，（A）和（B）的重量比为 从99：1到5:95。

    Thermoplastic silicone elastomers from compatibilized polyamide resins
    9.
    发明申请
    Thermoplastic silicone elastomers from compatibilized polyamide resins 有权
    来自相容聚酰胺树脂的热塑性硅橡胶

    公开(公告)号：US20020091205A1

    公开(公告)日：2002-07-11

    申请号：US10014957

    申请日：2001-10-26

    Inventor： Christopher Michael Brewer ,  Igor Chorvath ,  Frances Marie Fournier ,  Michael Kang-Jen Lee ,  Dawei Li ,  Robert Leo Oldinski ,  Lenin James Petroff ,  Richard Leroy Rabe ,  David Joseph Romenesko ,  Yongjun Lee ,  Koji Nakanishi

    IPC: C08L077/00

    CPC classification number: C08L77/02 ,  C08G77/12 ,  C08G77/14 ,  C08G77/16 ,  C08G77/18 ,  C08G77/20 ,  C08G77/26 ,  C08G77/44 ,  C08G77/445 ,  C08G77/448 ,  C08G77/455 ,  C08G77/458 ,  C08G77/46 ,  C08L77/00 ,  C08L77/06 ,  C08L83/04 ,  Y10S525/903 ,  C08L83/00 ,  C08L2666/14

    Abstract: A method for preparing a thermoplastic elastomer is disclosed, said method comprising (I) mixing (A) a rheologically stable polyamide resin having a melting point or glass transition temperature of 25null C. to 275null C., (B) a silicone base comprising (Bnull) 100 parts by weight of a diorganopolysiloxane gum having a plasticity of at least 30 and having an average of at least 2 alkenyl groups in its molecule and (Bnull) 5 to 200 parts by weight of a reinforcing filler, the weight ratio of said silicone base to said polyamide resin is from 35:65 to 85:15, (C) a compatibilizer selected from (i) a coupling agent, (ii) a functional diorganopolysiloxane or (iii) a copolymer comprising at least one diorganopolysiloxane block and at least one block selected from polyamide, polyether, polyurethane, polyurea, polycarbonate or polyacrylate, (D) an organohydrido silicon compound which contains an average of at least 2 silicon-bonded hydrogen groups in its molecule and (E) a hydrosilation catalyst, components (D) and (E) being present in an amount sufficient to cure said diorganopolysiloxane (Bnull); and (II) dynamically curing said diorganopolysiloxane (Bnull).

    Abstract translation: 公开了一种制备热塑性弹性体的方法，所述方法包括（I）混合（A）熔点或玻璃化转变温度为25℃至275℃的流变学稳定的聚酰胺树脂，（B）硅氧烷基 包含（B'）100重量份的可塑性为至少30且在其分子中平均具有至少2个烯基的二有机聚硅氧烷胶，（B“）为（B”）5〜200重量份的增强填料， 所述硅氧烷基与所述聚酰胺树脂的重量比为35:65至85:15，（C）增容剂，其选自（i）偶联剂，（ii）官能二有机基聚硅氧烷或（iii）至少包含 一个二有机聚硅氧烷嵌段和至少一个选自聚酰胺，聚醚，聚氨酯，聚脲，聚碳酸酯或聚丙烯酸酯的嵌段;（D）有机氢化硅化合物，其在其分子中含有平均至少2个与硅键合的氢基团，（E）a 硅氢化催化剂，组合物 （D）和（E）以足以固化所述二有机聚硅氧烷（B'）的量存在; 和（II）动态固化所述二有机聚硅氧烷（B'）。

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