Invention Application
US20040035554A1 Heatsink, method of manufacturing the same and cooling apparatus using the same
审中-公开
散热器,其制造方法以及使用其的冷却装置
- Patent Title: Heatsink, method of manufacturing the same and cooling apparatus using the same
- Patent Title (中): 散热器,其制造方法以及使用其的冷却装置
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Application No.: US10633557Application Date: 2003-08-05
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Publication No.: US20040035554A1Publication Date: 2004-02-26
- Inventor: Kaoru Sato , Yasuhiro Fujiwara , Seiji Manabe , Shinobu Kamizuru
- Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Applicant Address: JP Osaka
- Assignee: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Current Assignee: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Current Assignee Address: JP Osaka
- Priority: JP2000-005533 20000114
- Main IPC: F28F007/00
- IPC: F28F007/00 ; F28F001/00 ; F24H003/02 ; B23P006/00 ; B23P015/26 ; B21K021/00 ; B21D053/06

Abstract:
A heatsink of the present invention has a column having a heat conducting plate with a heat receiving face contacting a heat producing element. On the side faces of the column are a plurality of first slits disposed parallel to the heat receiving face and a plurality of second slits disposed transversely to the heat receiving face. These slits form a plurality of pillar-type protrusions functioning as fins for cooling. At least one of cross sections of the column has a shape of a rectangle, a trapezoid, a triangle or a shape which tapers off as it goes away at right angle from the heat receiving face. A method of manufacturing the heatsink of the present invention includes first and second processes. In the first process, the first slits are formed by providing a plurality of metallic plate fins on the column along its length by the methods including the extrusion molding using a metallic mold. In the second process, the second slits are formed in a direction approximately transverse to the length direction of the plate fins. By using a specialized jig for the machining of the second slits, many fins can be formed remarkably efficiently. A cooling apparatus for the present invention includes a cooling means mounted on the heatsink of the present invention. The cooling apparatus for the present invention enjoys a high cooling capability and reduced size.
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