发明申请
- 专利标题: Three-dimensional intergrated inductor, its module and fabrication method of the same
- 专利标题(中): 三维集成电感器,其模块和制造方法相同
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申请号: US10223362申请日: 2002-08-20
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公开(公告)号: US20040036569A1公开(公告)日: 2004-02-26
- 发明人: Shu-Hui Tsai , Shang-Yu Liang , Chun-Hsien Lee
- 申请人: Asia Pacific Microsystems, Inc.
- 申请人地址: null
- 专利权人: Asia Pacific Microsystems, Inc.
- 当前专利权人: Asia Pacific Microsystems, Inc.
- 当前专利权人地址: null
- 主分类号: H01F005/00
- IPC分类号: H01F005/00
摘要:
A three dimensional adjustable high frequency inductor, its module and fabrication method of the same; the high frequency module comprises micro high frequency inductors, filters, resistors, capacitors and associated with active components or power components to form a hybrid circuit, then it is packaged by using the technology of flip chip or wafer level packaging, so as to upgrade properties of high frequency modules and reduce the packaging and instrumentation costs by minimizing the modular size.