公开(公告)号：US20040036569A1

公开(公告)日：2004-02-26

申请号：US10223362

申请日：2002-08-20

申请人： Asia Pacific Microsystems, Inc.

发明人： Shu-Hui Tsai ,  Shang-Yu Liang ,  Chun-Hsien Lee

IPC分类号： H01F005/00

CPC分类号： H01F17/0033 ,  H01F41/042 ,  H01L27/08 ,  Y10T29/4902

摘要： A three dimensional adjustable high frequency inductor, its module and fabrication method of the same; the high frequency module comprises micro high frequency inductors, filters, resistors, capacitors and associated with active components or power components to form a hybrid circuit, then it is packaged by using the technology of flip chip or wafer level packaging, so as to upgrade properties of high frequency modules and reduce the packaging and instrumentation costs by minimizing the modular size.

摘要翻译： 三维可调高频电感器，其模块和制造方法相同; 高频模块包括微型高频电感器，滤波器，电阻器，电容器，并与有源元件或功率元件相关联以形成混合电路，然后通过使用倒装芯片或晶圆级封装的技术进行封装，从而提高性能 的高频模块，并通过最小化模块化尺寸来降低封装和仪器成本。

公开(公告)号：US20040063039A1

公开(公告)日：2004-04-01

申请号：US10464495

申请日：2003-06-19

申请人： ASIA PACIFIC MICROSYSTEMS, INC.

发明人： Shang-Yu Liang ,  Shu-Hui Tsai ,  Chun-Hsien Lee ,  Chung-Hsien Lin

IPC分类号： G03F007/16 ,  G03F007/20 ,  G03F007/40

CPC分类号： H01L23/645 ,  H01F17/0013 ,  H01F41/045 ,  H01F2017/0046 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/16 ,  H01L2924/3011 ,  H01L2924/00014

摘要： Disclosed herein is a method for inductor An Improved Structure For the Endpiece of Tape Rule of the high frequency integrated passive devices in which a spiral inductor pattern is formed on an insulation substrate, the spiral inductor pattern is spirally coiled outwards from the center. A thick film dielectric layer made of bisbenzocyclobutene (BCB) is formed on the spiral inductor pattern. A metal layer can be formed according to under bump metallization technique (UBM). The metal layer is either formed into a continuous spirally coiled form or a spread discrete configuration. With this structure, laser trimming can be applied to the metal layer pattern so as to acquire an ideal inductance value, thereby achieving wafer level trimming and compensating the process tolerance.

摘要翻译： 这里公开了一种电感器的方法。在绝缘基板上形成有螺旋形电感器图案的高频集成无源器件的带状端子规则的改进结构中，螺旋形电感器图案从中心向外螺旋地卷绕。 在螺旋电感图案上形成由双苯并环丁烯（BCB）制成的厚膜电介质层。 可以根据凸块下金属化技术（UBM）形成金属层。 金属层或者形成为连续的螺旋卷曲形式或扩展的离散构造。 利用该结构，可以对金属层图案施加激光微调，以获得理想的电感值，从而实现晶片级修整并补偿工艺公差。