A method for producing a wiring substrate provided with bumps protruding from a surface of the substrate, the method comprising the steps of: covering one side of a metallic base with an electrical insulating film and forming open holes in the insulating film so as to expose at the bottoms thereof the base, etching the base using the insulating film having the open holes formed as a mask to form concavities in the base, electroplating the interior face of each of the concavities using the base as a plating power supply layer to form a barrier metal film on the interior face of each concavities, filling the concavities with a material for the bump by electroplating using the base as a plating power supply layer, forming a barrier layer on the surface of the material for the bump filled in each of the concavities using the base as a plating power supply layer, forming a stack of a predetermined number of wiring patterns on the insulating film, the adjacent wiring patterns in the stack being separated from each other by an intervening insulating layer and being connected to each other through vias formed in the intervening insulating layer, and the wiring patterns being electrically connected to the material for the bump filled in the concavities, removing the base from the stack of wiring patterns having bumps each having the barrier metal film, and removing the barrier metal film from each of the bumps.