公开(公告)号：US20040046244A1

公开(公告)日：2004-03-11

申请号：US10649745

申请日：2003-08-28

申请人： Shinko Electric Industries Co., Ltd.

发明人： Jyunichi Nakamura ,  Tadashi Kodaira ,  Shunichiro Matsumoto ,  Hironari Aratani ,  Takanori Tabuchi ,  Takeshi Chino

IPC分类号： H01L023/053 ,  H01L023/12

CPC分类号： H05K3/0061 ,  H01L23/49822 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/15311 ,  H05K1/0271 ,  H05K3/205 ,  H05K3/3457 ,  H05K3/4644 ,  H05K2201/09472 ,  H05K2201/0969 ,  H05K2201/2009 ,  H05K2203/1536

摘要： A multilayered substrate for a semiconductor device, which has a multilayered substrate body formed of a plurality sets of a conductor layer and an insulation layer, and having a face for mounting a semiconductor element thereon and another face for external connection terminals, the face for mounting a semiconductor device being provided with pads through which the substrate is connected to a semiconductor element to be mounted thereon, and the face for external connection terminals being provided with pads through which the substrate is connected to an external electrical circuit, wherein a reinforcing sheet is respectively joined to the face for mounting a semiconductor element thereon and the face for external connection terminals of the multilayered substrate body.

公开(公告)号：US20040060174A1

公开(公告)日：2004-04-01

申请号：US10661530

申请日：2003-09-15

申请人： SHINKO ELECTRIC INDUSTRIES CO. LTD.

发明人： Kei Imafuji ,  Tadashi Kodaira ,  Takeshi Chino ,  Jyunichi Nakamura ,  Miwa Abe

IPC分类号： H05K003/36

CPC分类号： H01L21/6835 ,  H01L21/4857 ,  H01L23/49816 ,  H01L2221/68345 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K3/205 ,  H05K3/3473 ,  H05K3/4007 ,  H05K3/4644 ,  H05K2201/0367 ,  H05K2203/0338 ,  H05K2203/0376 ,  H05K2203/0384 ,  H05K2203/0726 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49144 ,  Y10T29/49156 ,  Y10T29/49165 ,  H01L2224/05599

摘要： A method for producing a wiring substrate provided with bumps protruding from a surface of the substrate, the method comprising the steps of: covering one side of a metallic base with an electrical insulating film and forming open holes in the insulating film so as to expose at the bottoms thereof the base, etching the base using the insulating film having the open holes formed as a mask to form concavities in the base, electroplating the interior face of each of the concavities using the base as a plating power supply layer to form a barrier metal film on the interior face of each concavities, filling the concavities with a material for the bump by electroplating using the base as a plating power supply layer, forming a barrier layer on the surface of the material for the bump filled in each of the concavities using the base as a plating power supply layer, forming a stack of a predetermined number of wiring patterns on the insulating film, the adjacent wiring patterns in the stack being separated from each other by an intervening insulating layer and being connected to each other through vias formed in the intervening insulating layer, and the wiring patterns being electrically connected to the material for the bump filled in the concavities, removing the base from the stack of wiring patterns having bumps each having the barrier metal film, and removing the barrier metal film from each of the bumps.

摘要翻译： 一种制造布线基板的方法，所述布线基板设置有从所述基板的表面突出的凸起，所述方法包括以下步骤：用电绝缘膜覆盖金属基底的一侧并在所述绝缘膜中形成露出孔，以暴露在 其底部使用具有形成为掩模的开孔的绝缘膜蚀刻基底，以在基底中形成凹部，使用基底电镀每个凹部的内表面作为电镀电源层以形成屏障 在每个凹部的内表面上的金属膜，通过使用基底作为电镀电源层的电镀将用于凸块的材料填充凹部，在填充在每个凹部中的凸块材料的表面上形成阻挡层 使用基底作为电镀电源层，在绝缘膜上形成预定数量的布线图案的叠层，堆叠中的相邻布线图案 通过中间绝缘层彼此分离并且通过形成在中间绝缘层中的通孔彼此连接，并且布线图案电连接到填充在凹部中的用于凸块的材料，从堆叠中去除基底 具有各自具有阻挡金属膜的凸块的布线图案，以及从每个凸块去除阻挡金属膜。