发明申请
- 专利标题: Adhesive for bonding to low surface energy surfaces
- 专利标题(中): 用于粘合到低表面能表面的粘合剂
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申请号: US10610950申请日: 2003-07-01
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公开(公告)号: US20040082700A1公开(公告)日: 2004-04-29
- 发明人: Ashish K. Khandpur , Jingjing Ma , Mark D. Gehlsen , Bradley S. Momchilovich , John J. Stradinger
- 申请人: 3M Innovative Properties Company
- 申请人地址: null
- 专利权人: 3M Innovative Properties Company
- 当前专利权人: 3M Innovative Properties Company
- 当前专利权人地址: null
- 主分类号: C08K005/01
- IPC分类号: C08K005/01 ; B32B027/00
摘要:
A novel polymodal asymmetric elastomeric block copolymer and a pressure sensitive adhesive, tape and adhesive backed article made therefrom, such as a polymer foam article having a substantially smooth surface prepared by melt-mixing a polymer composition and a plurality of microspheres, at least one of which is an expandable polymeric microsphere, under process conditions, including temperature and shear rate, selected to form an expandable extrudable composition; and extruding the composition through a die.
公开/授权文献
- US07163741B2 Adhesive for bonding to low surface energy surfaces 公开/授权日:2007-01-16
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