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公开(公告)号：US20040229000A1
公开(公告)日：2004-11-18
申请号：US10868480
申请日：2004-06-15
发明人： Ashish K. Khandpur , JingJing Ma , Mark D. Gehlsen , Bradley S. Momchilovich , John J. Stradinger
IPC分类号： B32B007/12
CPC分类号： B32B27/065 , B32B5/18 , B32B7/02 , B32B2266/0242 , B32B2307/72 , B32B2405/00 , C08F297/044 , C08L2666/02 , C08L2666/04 , C08L2666/24 , C09J5/08 , C09J7/10 , C09J7/26 , C09J7/387 , C09J151/003 , C09J153/00 , C09J153/02 , C09J2205/11 , C09J2433/006 , C09J2453/00 , C09J2453/006 , Y10T428/1376 , Y10T428/1452 , Y10T428/249983 , Y10T428/2883 , Y10T428/31855 , Y10T428/31931
摘要： A novel polymodal asymmetric elastomeric block copolymer and a pressure sensitive adhesive, tape and adhesive backed article made therefrom, such as a polymer foam article having a substantially smooth surface prepared by melt-mixing a polymer composition and a plurality of microspheres, at least one of which is an expandable polymeric microsphere, under process conditions, including temperature and shear rate, selected to form an expandable extrudable composition; and extruding the composition through a die.
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公开(公告)号：US20040082700A1
公开(公告)日：2004-04-29
申请号：US10610950
申请日：2003-07-01
发明人： Ashish K. Khandpur , Jingjing Ma , Mark D. Gehlsen , Bradley S. Momchilovich , John J. Stradinger
IPC分类号： C08K005/01 , B32B027/00
CPC分类号： C09J151/003 , B32B5/18 , C08F297/044 , C08L2666/02 , C08L2666/04 , C08L2666/24 , C09J7/26 , C09J7/387 , C09J153/02 , C09J2433/006 , Y10T428/24355 , Y10T428/249953 , Y10T428/249981 , Y10T428/249982 , Y10T428/249983 , Y10T428/249984 , Y10T428/249985 , Y10T428/2878 , Y10T428/2883 , Y10T428/31855
摘要： A novel polymodal asymmetric elastomeric block copolymer and a pressure sensitive adhesive, tape and adhesive backed article made therefrom, such as a polymer foam article having a substantially smooth surface prepared by melt-mixing a polymer composition and a plurality of microspheres, at least one of which is an expandable polymeric microsphere, under process conditions, including temperature and shear rate, selected to form an expandable extrudable composition; and extruding the composition through a die.
摘要翻译： 一种新型多聚不对称弹性体嵌段共聚物和由其制成的压敏粘合剂，胶带和粘合剂背衬制品，例如通过将聚合物组合物和多个微球熔融混合制备的具有基本平滑表面的聚合物泡沫制品， 其是在可选择形成可膨胀的可挤出组合物的工艺条件下，包括温度和剪切速率的可发泡聚合物微球; 并通过模具挤出组合物。
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公开(公告)号：US20040197545A1
公开(公告)日：2004-10-07
申请号：US10835865
申请日：2004-04-30
IPC分类号： C08L001/00 , C08J003/00 , B32B003/26 , B32B003/00 , B32B007/12 , B32B015/04
CPC分类号： C09J7/041 , B29C44/18 , B29C44/3484 , B29C47/00 , B29C47/0004 , B29C47/0016 , B29C47/0021 , B29C47/0023 , B29C47/003 , B29C47/0033 , B29C47/364 , B29C47/367 , B29C47/369 , B29C47/56 , B29C70/66 , B29K2105/048 , B29K2105/165 , C08J9/32 , C08J2203/22 , C08J2207/02 , C08L33/00 , C09J5/08 , C09J7/21 , C09J7/241 , C09J7/29 , C09J7/30 , C09J11/08 , C09J2433/00 , Y10T428/249953 , Y10T428/249954 , Y10T428/249971 , Y10T428/249972 , Y10T428/249978 , Y10T428/249981 , Y10T428/249983 , Y10T428/249984 , Y10T428/249986 , Y10T428/28 , Y10T428/2848 , Y10T428/2891
摘要： Polymer foam articles prepared by melt-mixing a polymer composition and a plurality of microspheres, at least one of which is an expandable polymeric microsphere, under process conditions, including temperature and shear rate, selected to form an expandable extrudable composition; and extruding the composition through a die.
摘要翻译： 通过熔融混合聚合物组合物和多个微球（其中至少一个是可发泡聚合物微球体）在包括温度和剪切速率在内的工艺条件下熔融混合而制备的聚合物泡沫制品，其选择以形成可膨胀的可挤出组合物; 并通过模具挤出组合物。
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公开(公告)号：US20040260024A1
公开(公告)日：2004-12-23
申请号：US10600983
申请日：2003-06-20
IPC分类号： C08L033/06
CPC分类号： C09J7/26 , C09J7/22 , C09J7/38 , C09J2201/128 , C09J2201/134 , C09J2433/00 , C09J2433/006 , Y10T428/1457 , Y10T428/28 , Y10T428/2887 , Y10T428/2891
摘要： The present invention relates to a double-sided pressure sensitive adhesive foam tape. In certain embodiments the foam tape does not require the use of a release liner. Elimination of the release liner reduces the cost of the tape and also avoids problems associated with damage to the liner during traditional tape manufacturing from exposure to e-beam radiation.
摘要翻译： 本发明涉及一种双面压敏粘合剂泡沫胶带。 在某些实施方案中，泡沫胶带不需要使用剥离衬垫。 释放衬垫的消除降低了胶带的成本，并且还避免了在从暴露于电子束辐射的传统胶带制造过程中与衬垫损坏相关的问题。
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