发明申请
US20040163764A1 Inductively coupled RF plasma reactor and plasma chamber enclosure structure therefor
审中-公开
电感耦合射频等离子体反应器及其等离子体室结构
- 专利标题： Inductively coupled RF plasma reactor and plasma chamber enclosure structure therefor
- 专利标题（中）： 电感耦合射频等离子体反应器及其等离子体室结构
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申请号： US10786424申请日： 2004-02-25
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公开(公告)号： US20040163764A1公开(公告)日： 2004-08-26
- 发明人: Kenneth S. Collins , Michael Rice , John Trow , Douglas Buchberger , Craig A. Roderick
- 申请人： Applied Materials, Inc.
- 申请人地址： null
- 专利权人： Applied Materials, Inc.
- 当前专利权人： Applied Materials, Inc.
- 当前专利权人地址： null
- 主分类号： H01L021/306
- IPC分类号： H01L021/306 ; C23C016/00
摘要：
A plasma chamber enclosure structure for use in an RF plasma reactor. The plasma chamber enclosure structure being a single-wall dielectric enclosure structure of an inverted cup-shape configuration and having ceiling with an interior surface of substantially flat conical configuration extending to a centrally located gas inlet. The plasma chamber enclosure structure having a sidewall with a lower cylindrical portion generally transverse to a pedestal when positioned over a reactor base, and a transitional portion between the lower cylindrical portion and the ceiling. The transitional portion extends inwardly from the lower cylindrical portion and includes a radius of curvature. The structure being adapted to cover the base to comprise the RF plasma reactor and to define a plasma-processing volume over the pedestal. The structure being formed of a dielectric material of silicon, silicon carbide, quartz, and/or alumina being capable of transmitting inductive power therethrough from an adjacent antenna.
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