摘要:
A machining device includes first branched waveguides (71A-71C) and second branched waveguides (73A-73C) connected perpendicularly to an axial (Z) direction of a cylindrical waveguide (14) and having one end which opens in the cylindrical waveguide (14) and the other end which is electrically short-circuited. The first branched waveguides (71A-71C) are arranged at a predetermined interval in an axial (z) direction of the cylindrical waveguide (14). The second branched waveguides (73A-73C) are arranged in positions which make an angle of 90null with positions of the first branched waveguides (71A-71C) when viewed from the axis (Z) of the cylindrical waveguide (14), and arranged at a predetermined interval in the axial (Z) direction of the cylindrical waveguide (14). With this arrangement, it is possible to accurately and easily control the impedance matching between the supply side and load side of the cylindrical waveguide (14).
摘要:
An apparatus is provided. The apparatus comprises a chamber for loading a substrate therein, a plasma creation area in the chamber, first and second electrodes installed in the chamber, and a power source for supplying a radio frequency to the first electrode. The first electrode includes a plurality of areas having different resistances for varying the radio frequency applied to the plasma creation area. The upper electrode makes a plasma density uniform to enhance a process uniformity.
摘要:
Processing apparatus is disclosed, that comprises substrate container holding table that can hold substrate container that contains plurality of target substrates, first transferring chamber, disposed adjacent to the substrate container holding table, that maintains the interior at first pressure, first processing unit group, disposed around the first transferring chamber, that processes target substrate at the first pressure, first transferring mechanism, disposed in the first transferring chamber, that transfers target substrate, second transferring chamber, disposed adjacent to the first transferring chamber, that maintains the interior at second pressure, second processing unit group, disposed around the second transferring chamber, that processes target substrate at the second pressure, and second transferring mechanism, disposed in the second transferring chamber, wherein the first transferring mechanism and/or the second transferring mechanism has at least two transferring arms.
摘要:
This invention relates to a method for coating at least one substrate with one or more layers in a process chamber, in particular of a CVD installation. According to said method, starting materials, in particular in the form of organometallic reaction gases are introduced into the process chamber and their mass flow is controlled. In said chamber, the starting materials or reaction products thereof are deposited on layers on the substrate that is held by a temperature controlled substrate holder. During a coating cycle, which begins with the charging of the process chamber with the substrate or substrates and ends with the removal of the same according to a predetermined formula, the desired values of the process parameters, such as mass flows of the starting materials and temperature of the substrate holder, are set and the actual values for each substrate that correspond with the desired values of the process parameters are individually determined at intervals and are stored in a memory. During said coating cycle, or after each coating cycle, or after one or more subsequent processing steps carried out on a layer or on a layer system consisting of several layers, identifying layer characteristics, such as layer thickness and layer composition are determined and are stored by being allocated to the individualized data of the corresponding substrate. The actual values that have been obtained and the layer characteristics that have been determined for a plurality of layers deposited with the same formula are then correlated and correlation values are generated.
摘要:
The invention relates to a method for depositing mechanically and thermodynamically stable amorphous carbon layers using a low-pressure plasma deposition method, especially a PE-CVD or combined PVD-/PE-CVD method. According to the invention, the average kinetic energy per deposited carbon atom is lower than 20 eV, preferably lower than 10 eV, and the ionic current density j is smaller than 0.2 mA/cm2, and preferably smaller than 0.1 mA/cm2.
摘要:
Disclosed is an ion beam-assisted deposition system that includes a bi-lateral RF ion source system that, when used in conjunction with an electron beam, magnetron or ion beam evaporator assembly, creates a deposition zone of sufficient width to enable simultaneous deposition onto a plurality of parallel-arranged translating metal substrate tapes. The arrangement of the bilateral RF ion source is such that a pair of RF ion sources is arranged on opposite sides of an evaporation source in such a manner that a pair of ion beams is directed toward a translating set of parallel-arranged substrate tapes at incident angles of, for example, 55 degrees.
摘要:
By thermal spraying, a coating having an embossed or slit pattern is formed on a substrate to construct a coated member. When the coated member is used for sintering compacts, the embossed or slit pattern on the surface helps prevent the compacts from sticking to the coated member during sintering, discourages coating separation due to thermal cycling, and provides the coated member with excellent durability. Such coated members can be effectively used for sintering or heat treating ceramics and powder metallurgy metals, particularly cermets and cemented carbides, in a vacuum, oxidizing atmosphere, inert atmosphere or reducing atmosphere.
摘要:
Rapid thermal processing apparatus methods are disclosed. In a disclosed apparatus, rapid thermal processing is carried out when the residual oxygen detected by a residual oxygen detector does not exceed a predetermined tolerance level. Accordingly, it is possible to prevent the contact resistance of the wafers from increasing due to the presence of excessive oxygen.
摘要:
A method for depositing a low dielectric constant film having a dielectric constant of about 3.2 or less, preferably about 3.0 or less, includes providing a cyclic organosiloxane and a linear hydrocarbon compound having at least one unsaturated carbon-carbon bond to a substrate surface. In one aspect, the cyclic organosiloxane and the linear hydrocarbon compound are reacted at conditions sufficient to deposit a low dielectric constant film on the semiconductor substrate. Preferably, the low dielectric constant film has compressive stress.
摘要:
To realize the temperature control of the sample-setting portion and enable to perform exposure or inspection of samples accurately while preventing the generation of dust, deterioration of the degree of vacuum and contamination in a vacuum atmosphere. (Means of Solving the Problems) The top table 21 or sample holding mechanism 7 is equipped with a temperature sensor 23, the flow path 251 of the heat-exchanging medium 241 is provided inside the non-moving fixed side guide member 181, and the temperature of the sample-setting portion is controlled through the control of the medium 241. Since the flow path 251 of the heat-exchanging medium 241 is located in a stationary portion, it is possible to control the temperature of the sample-setting portion while preventing the generation of dust due to flexible piping, damage to vacuum pump and contamination in a vacuum atmosphere caused by the heat-exchanging medium 241.