Invention Application
- Patent Title: SOLDER REFLOW OVEN
- Patent Title (中): 焊接反炉
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Application No.: US10410081Application Date: 2003-04-09
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Publication No.: US20040200877A1Publication Date: 2004-10-14
- Inventor: Lakhi Nandlal Goenka
- Applicant: Visteon Global Technologies, Inc.
- Applicant Address: null
- Assignee: Visteon Global Technologies, Inc.
- Current Assignee: Visteon Global Technologies, Inc.
- Current Assignee Address: null
- Main IPC: B23K001/00
- IPC: B23K001/00
Abstract:
A solder reflow oven comprises a reflow zone for heating a workpiece using heated air to a temperature effective to reflow solder. The reflow zone comprises a nozzle having divergent vanes that direct shear layers into neighboring zones to extend the distance over which the workpiece is heated to effective solder reflow temperatures.
Public/Granted literature
- US06794616B1 Solder reflow oven Public/Granted day:2004-09-21
Information query
