公开(公告)号：US20040200877A1

公开(公告)日：2004-10-14

申请号：US10410081

申请日：2003-04-09

Applicant: Visteon Global Technologies, Inc.

Inventor： Lakhi Nandlal Goenka

IPC: B23K001/00

CPC classification number: F27B9/00 ,  F27B9/10 ,  F27B9/24 ,  F27B9/36 ,  F27D5/0012 ,  F27D9/00 ,  F27D2009/0075

Abstract: A solder reflow oven comprises a reflow zone for heating a workpiece using heated air to a temperature effective to reflow solder. The reflow zone comprises a nozzle having divergent vanes that direct shear layers into neighboring zones to extend the distance over which the workpiece is heated to effective solder reflow temperatures.

Abstract translation: 回流焊炉包括用于使用加热的空气将工件加热到有效回流焊料的温度的回流区。 回流区包括具有发散叶片的喷嘴，其将剪切层引导到相邻区域中，以将加工工件的距离延伸到有效的回流焊温度。