Invention Application
- Patent Title: Semiconductor device and process for producing the same, and tablet comprising epoxy resin composition
-
Application No.: US10843339Application Date: 2004-05-12
-
Publication No.: US20040210008A1Publication Date: 2004-10-21
- Inventor: Akihisa Kuroyanagi , Hisataka Ito , Shinichirou Sudo , Hirofumi Oono
- Applicant: Nitto Denko Corporation
- Applicant Address: null
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: null
- Priority: JP2000-92028 20000329; JP2000-92029 20000329; JP2000-92030 20000329
- Main IPC: C08L071/02
- IPC: C08L071/02 ; H01L023/495
Abstract:
A tablet for producing a semiconductor device with substantially no bowing, comprising an epoxy resin composition comprising an epoxy resin and a curing agent, wherein the tablet has the characteristic of an amount reduced by heating being less than 0.05% by weight; a wafer with a resin layer and a semiconductor device produced by using the tablet; and a process for producing the wafer and the semiconductor device.
Public/Granted literature
- US06933618B2 Tablet comprising epoxy resin composition Public/Granted day:2005-08-23
Information query
