发明申请
- 专利标题： Method and apparatus for expanding a semiconductor wafer
- 专利标题（中）： 用于扩展半导体晶片的方法和装置
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申请号： US10866148申请日： 2004-06-14
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公开(公告)号： US20040250949A1公开(公告)日： 2004-12-16
- 发明人: Michael R. Arneson , William R. Bandy
- 申请人： Matrics, Inc.
- 申请人地址： null
- 专利权人： Matrics, Inc.
- 当前专利权人： Matrics, Inc.
- 当前专利权人地址： null
- 主分类号： B32B031/00
- IPC分类号： B32B031/00
摘要：
Methods, systems, and apparatuses are described for expanding an area of a semiconductor wafer, an enhancing die transfer capability. A wafer is attached to a support structure. The wafer is separated on the support structure into a plurality of dies. An area of the support structure is increased to increase a space between adjacent dies of the plurality of dies. Dies may be transferred from the expanded support structure.
公开/授权文献
- US07223320B2 Method and apparatus for expanding a semiconductor wafer 公开/授权日：2007-05-29
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