公开(公告)号：US20020149483A1

公开(公告)日：2002-10-17

申请号：US10073000

申请日：2002-02-12

申请人： Matrics, Inc.

发明人： Wayne E. Shanks ,  William R. Bandy ,  Kevin J. Powell ,  Michael R. Arneson

IPC分类号： G08B013/14

CPC分类号： G06K19/07749 ,  G06K7/0008 ,  G06K7/10039 ,  G06K7/10069 ,  G06K7/10108 ,  G06K7/10356 ,  G06K17/00 ,  G06K19/0713 ,  G06K19/0723 ,  G06K19/07767 ,  G08B13/2485 ,  G11C5/142 ,  H04L7/0331

摘要： A method, system, and apparatus for communicating with a radio frequency identification (RFID) tag population that includes one or more tags are described. The tags are interrogated by a reader which may be located in a network of readers. The reader interrogates the tags by transmitting data symbols to the tags. Tags respond to the reader with backscatter symbols. Bit patterns, such as identification numbers stored in the tags, are collected from the plurality of tags without collisions. Collisions are avoided because the backscatter symbols transmitted by the tags use different characteristics to represent different data bits. For example, a first backscatter symbol frequency is used by the tag to represent a null0null bit, and a second backscatter symbol frequency is used by the tag to represent a null1null bit.

摘要翻译： 描述了与包括一个或多个标签的射频识别（RFID）标签群进行通信的方法，系统和装置。 这些标签由可能位于读取器网络中的读取器询问。 读者通过向标签发送数据符号来询问标签。 标签用反向散射符号回应读者。 诸如标签中存储的识别号码的位模式从多个标签中收集而不发生冲突。 避免了碰撞，因为标签发送的反向散射符号使用不同的特性来表示不同的数据位。 例如，标签使用第一反向散射符号频率来表示“0”比特，并且标签使用第二反向散射符号频率来表示“1”比特。

公开(公告)号：US20040251541A1

公开(公告)日：2004-12-16

申请号：US10866151

申请日：2004-06-14

申请人： Matrics, Inc.

发明人： Michael R. Arneson ,  William R. Bandy

IPC分类号： H01L029/06

CPC分类号： H01L24/95 ,  G06K7/0095 ,  G06K19/041 ,  G06K19/045 ,  G06K19/077 ,  G06K19/07718 ,  G11B7/26 ,  G11B23/0021 ,  G11B23/0042 ,  H01L21/67132 ,  H01L21/67144 ,  H01L21/68 ,  H01L21/6835 ,  H01L21/78 ,  H01L24/75 ,  H01L24/81 ,  H01L2221/68322 ,  H01L2221/68354 ,  H01L2223/54473 ,  H01L2224/16 ,  H01L2224/75 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/3011 ,  H01L2924/3025 ,  Y10S438/976 ,  Y10T29/49018 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49798 ,  Y10T29/49833 ,  Y10T29/53178 ,  Y10T29/53187 ,  Y10T29/5327 ,  Y10T29/53422 ,  Y10T156/1075 ,  Y10T156/1142 ,  Y10T156/1179 ,  Y10T156/1906 ,  Y10T156/1978 ,  Y10T156/1983 ,  H01L2924/00 ,  H01L2224/0401

摘要： Methods, systems, and apparatuses for forming a radio frequency identifiable disc medium storage device are described. A metal layer is deposited onto a disc. At least one metal trace on the disc is connected to the metal layer. An adhesive interposer is attached to the disc around an opening in the center of the disc. The interposer includes an integrated circuit die. Pads of the integrated circuit die are coupled to the at least one pair of metal traces by the interposer. The interposer further includes a matching network. A coating is formed on the disc to encapsulate the metal layer, interposer, and integrated circuit die.

摘要翻译： 描述了用于形成射频识别盘介质存储装置的方法，系统和装置。 金属层沉积在盘上。 盘上的至少一个金属迹线连接到金属层。 粘合剂插入件围绕盘的中心的开口附接到盘。 插入器包括集成电路管芯。 集成电路管芯的焊盘通过插入件耦合到至少一对金属迹线。 插入器还包括匹配网络。 在盘上形成涂层以封装金属层，插入件和集成电路管芯。

公开(公告)号：US20040250949A1

公开(公告)日：2004-12-16

申请号：US10866148

申请日：2004-06-14

申请人： Matrics, Inc.

发明人： Michael R. Arneson ,  William R. Bandy

IPC分类号： B32B031/00

CPC分类号： H01L24/95 ,  G06K7/0095 ,  G06K19/041 ,  G06K19/045 ,  G06K19/077 ,  G06K19/07718 ,  G11B7/26 ,  G11B23/0021 ,  G11B23/0042 ,  H01L21/67132 ,  H01L21/67144 ,  H01L21/68 ,  H01L21/6835 ,  H01L21/78 ,  H01L24/75 ,  H01L24/81 ,  H01L2221/68322 ,  H01L2221/68354 ,  H01L2223/54473 ,  H01L2224/16 ,  H01L2224/75 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/3011 ,  H01L2924/3025 ,  Y10S438/976 ,  Y10T29/49018 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49798 ,  Y10T29/49833 ,  Y10T29/53178 ,  Y10T29/53187 ,  Y10T29/5327 ,  Y10T29/53422 ,  Y10T156/1075 ,  Y10T156/1142 ,  Y10T156/1179 ,  Y10T156/1906 ,  Y10T156/1978 ,  Y10T156/1983 ,  H01L2924/00 ,  H01L2224/0401

摘要： Methods, systems, and apparatuses are described for expanding an area of a semiconductor wafer, an enhancing die transfer capability. A wafer is attached to a support structure. The wafer is separated on the support structure into a plurality of dies. An area of the support structure is increased to increase a space between adjacent dies of the plurality of dies. Dies may be transferred from the expanded support structure.

摘要翻译： 描述了用于扩展半导体晶片的面积，增强的模具转移能力的方法，系统和装置。 将晶片连接到支撑结构。 晶片在支撑结构上分离成多个模具。 增加支撑结构的区域以增加多个模具的相邻模具之间的间隔。 模具可以从扩展的支撑结构转移。

公开(公告)号：US20040207527A1

公开(公告)日：2004-10-21

申请号：US10840790

申请日：2004-05-07

申请人： Matrics, Inc.

发明人： Wayne E. Shanks ,  William R. Bandy ,  Michael R. Arneson ,  Kevin J. Powell

IPC分类号： G08B013/14

CPC分类号： G06K19/07749 ,  G06K7/0008 ,  G06K7/10039 ,  G06K7/10069 ,  G06K7/10108 ,  G06K7/10356 ,  G06K17/00 ,  G06K19/0713 ,  G06K19/0723 ,  G06K19/07767 ,  G08B13/2485 ,  G11C5/142 ,  H04L7/0331

摘要： An identification (ID) tag includes a substrate having an input capable of receiving a high frequency signal. For instance, the high frequency signal can be a radio frequency (RF) signal that is generated as part of a radio frequency (RF) ID system. A first charge pump is coupled to the input and is configured to convert the high frequency signal to a substantially direct current (DC) voltage. A data recovery circuit is coupled to the input and is capable of recovering data from the high frequency signal. A back scatter switch is coupled to the input and is capable of modifying an impedance of the input, responsive to a control signal. A state machine is disposed on the substrate and is responsive to the data recovered by the second charge pump, where the state machine is capable of generating the control signal for the back scatter switch in response to the data. The DC voltage from the first charge pump is capable of providing a voltage supply for at least one of the data recovery circuit, the back scatter switch, and the state machine. The data recovery circuit includes a second charge pump that is capable of operating on the high frequency signal simultaneously with the first charge pump. In other words, the first charge pump can generate the supply voltage for the ID tag from the high frequency signal, while the second charge pump simultaneously retrieves the data from the high frequency signal. The first charge pump also includes a means for limiting the amplitude of the DC voltage by reducing the charge pump efficiency, once a threshold voltage is reached.

公开(公告)号：US20040020039A1

公开(公告)日：2004-02-05

申请号：US10322718

申请日：2002-12-19

申请人： Matrics, Inc.

发明人： Michael R. Arneson ,  William R. Bandy

IPC分类号： H01R043/00 ,  B65B001/00 ,  B23P019/00

CPC分类号： G06K19/07718 ,  B29C33/06 ,  G06K19/07745 ,  G06K19/07749 ,  G06K19/0775 ,  G06K19/07758 ,  H01L21/56 ,  H01L21/6835 ,  H01L23/49855 ,  H01L24/96 ,  H01L2221/68354 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/81191 ,  H01L2224/83191 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  Y10T29/49016 ,  Y10T29/4902 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49826 ,  Y10T29/49885 ,  Y10T29/53039 ,  Y10T29/5313 ,  Y10T29/53178 ,  Y10T29/53191 ,  Y10T29/53261 ,  Y10T156/10 ,  H01L2924/00

摘要： A method and system for transferring a plurality of integrated circuit dies from a first surface to a second surface is described. Each hollow barrel of a plurality of hollow barrels is applied to a respective die residing on the first surface. The respective die is caused to move into each hollow barrel in parallel. These steps are repeated until each hollow barrel contains a stack of dies of a predetermined number. A die from each hollow barrel is deposited onto the second surface until the stack of dies contained by each hollow barrel is substantially depleted.

摘要翻译： 描述了用于将多个集成电路管芯从第一表面传递到第二表面的方法和系统。 多个空心筒的每个中空筒被施加到位于第一表面上的相应的模具。 使相应的模具平行地移动到每个中空筒体中。 重复这些步骤，直到每个中空圆筒包含预定数量的模具堆叠。 来自每个中空筒的模具沉积到第二表面上，直到每个中空筒体所包含的模具堆基本上被耗尽。

公开(公告)号：US20040020040A1

公开(公告)日：2004-02-05

申请号：US10429803

申请日：2003-05-06

申请人： Matrics, Inc.

发明人： Michael R. Arneson ,  William R. Bandy

IPC分类号： H01R043/00 ,  B65B001/00 ,  B23P019/00

CPC分类号： H01L24/96 ,  B29C33/06 ,  G06K19/07718 ,  G06K19/07745 ,  G06K19/07749 ,  G06K19/0775 ,  G06K19/07758 ,  H01L21/56 ,  H01L21/563 ,  H01L21/67005 ,  H01L21/6835 ,  H01L21/6836 ,  H01L23/49855 ,  H01L23/544 ,  H01L24/12 ,  H01L24/28 ,  H01L24/29 ,  H01L24/82 ,  H01L24/83 ,  H01L24/90 ,  H01L24/97 ,  H01L2221/68313 ,  H01L2221/68327 ,  H01L2221/68354 ,  H01L2223/54426 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/73203 ,  H01L2224/81191 ,  H01L2224/83191 ,  H01L2224/83851 ,  H01L2224/90 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  Y10T29/49016 ,  Y10T29/49117 ,  Y10T29/49279 ,  Y10T29/49474 ,  Y10T29/49885 ,  Y10T29/4998 ,  Y10T29/5313 ,  Y10T156/10 ,  H01L2224/29075 ,  H01L2924/00014 ,  H01L2924/00

摘要： A method, system, and apparatus for a die frame, and for transferring integrated circuit dies therewith, is described. In one aspect for making a die frame, a wafer that comprises a plurality of dies is attached to a surface of a tape structure. A grid of grooves is formed in the wafer to separate the plurality of dies on the surface of the tape structure. A portion of the tape structure that is accessible through the grooves of the grid is caused to harden into a grid shaped structure. The grid shaped structure removably holds the plurality of dies. One or more dies of the plurality of dies can be moved from the grid shaped structure onto a target surface. In an alternative aspect, when the grid of grooves is formed in the wafer to separate the plurality of dies on the surface of the tape structure, the surface of the tape structure is breached in the grooves. The breach causes a hardening material encapsulated in the tape structure to be released and to harden in the grooves into a grid shaped hardened material.

摘要翻译： 描述了用于管芯框架的方法，系统和装置，以及用于传送集成电路管芯的方法。 在制造模具框架的一个方面中，包括多个模具的晶片被附接到带结构的表面。 在晶片中形成有格栅格以将带状结构的表面上的多个模具分开。 通过网格的凹槽可以接近的带结构的一部分被硬化成格状结构。 栅格状结构可移除地保持多个管芯。 多个管芯中的一个或多个管芯可以从栅格形结构移动到目标表面上。 在替代方案中，当在晶片中形成凹槽的格栅以在带结构的表面上分离多个模具时，带结构的表面在凹槽中被破坏。 破裂导致封装在带结构中的硬化材料被释放并且将槽硬化成网状硬化材料。

公开(公告)号：US20040020038A1

公开(公告)日：2004-02-05

申请号：US10322702

申请日：2002-12-19

申请人： Matrics, Inc.

发明人： Michael R. Arneson ,  William R. Bandy

IPC分类号： H01R043/00 ,  B23P019/00

CPC分类号： G06K19/07718 ,  B29C33/06 ,  G06K19/07745 ,  G06K19/07749 ,  G06K19/0775 ,  G06K19/07758 ,  H01L21/56 ,  H01L21/6835 ,  H01L23/49855 ,  H01L24/96 ,  H01L2221/68354 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/81191 ,  H01L2224/83191 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  Y10T29/49016 ,  Y10T29/4902 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49826 ,  Y10T29/49885 ,  Y10T29/53039 ,  Y10T29/5313 ,  Y10T29/53178 ,  Y10T29/53191 ,  Y10T29/53261 ,  Y10T156/10 ,  H01L2924/00

摘要： A method and system for transferring a plurality of integrated circuit dies from a first surface to a second surface is described. The second surface is positioned to be closely adjacent to the first surface that has a plurality of dies attached thereto. A distance is reduced between the first surface and the second surface until the plurality of dies contact the second surface and attach to the second surface due to an adhesiveness of the second surface. The first surface and second surface are moved apart. The plurality of dies remain attached to the second surface.

摘要翻译： 描述了用于将多个集成电路管芯从第一表面传递到第二表面的方法和系统。 第二表面定位成与附接有多个模具的第一表面紧密相邻。 在第一表面和第二表面之间的距离减小，直到多个模具接触第二表面并且由于第二表面的粘附性而附着到第二表面。 第一表面和第二表面被移开。 多个模具保持附接到第二表面。

公开(公告)号：US20030214389A1

公开(公告)日：2003-11-20

申请号：US10403019

申请日：2003-04-01

申请人： Matrics, Inc.

发明人： Michael R. Arneson ,  William R. Bandy

IPC分类号： H04Q005/22

CPC分类号： G06Q10/08 ,  G06K7/0008

摘要： A method and system for optimizing an interrogation of a tag population that includes a plurality of tags, wherein each of the plurality of tags is assigned a tag address includes determining a tag population size; selecting one of a plurality of efficiency profiles that matches the determined tag population size; and defining a plurality of interrogation read cycles according to the selected efficiency profile.

摘要翻译： 一种用于优化包括多个标签的标签群的询问的方法和系统，其中所述多个标签中的每一个被分配标签地址包括确定标签种群大小; 选择与所确定的标签群体大小匹配的多个效率简档中的一个; 以及根据所选择的效率分布来定义多个询问读周期。

公开(公告)号：US20020152044A1

公开(公告)日：2002-10-17

申请号：US10072874

申请日：2002-02-12

申请人： Matrics, Inc.

发明人： Wayne E. Shanks ,  William R. Bandy ,  Kevin J. Powell ,  Michael R. Arneson

IPC分类号： G06F019/00 ,  G01R023/00 ,  G08C019/16

CPC分类号： G06K19/07749 ,  G06K7/0008 ,  G06K7/10039 ,  G06K7/10069 ,  G06K7/10108 ,  G06K7/10356 ,  G06K17/00 ,  G06K19/0713 ,  G06K19/0723 ,  G06K19/07767 ,  G08B13/2485 ,  G11C5/142 ,  H04L7/0331

摘要： A method, system, and apparatus for a timing subsystem in a radio frequency identification tag device are described. The timing subsystem provides a system oscillator or clock for the tag. The timing subsystem also provides frequencies used by an RF interface of the tag to generate backscatter modulated symbols. The timing subsystem also provides for oscillator calibration. The tag receives one or more oscillator calibration waveforms transmitted by a reader. The timing subsystem in the tag uses the oscillator calibration waveforms to successively adjust the frequency of the tag oscillator to a frequency desired by the reader. Hence, the reader may increase or decrease the oscillator frequency in the tag depending on the particular application. Furthermore, the reader may adjust the oscillator frequency for all tags in a population of tags using a single transmission of the one or more oscillator calibration waveforms.

摘要翻译： 描述了射频识别标签设备中的定时子系统的方法，系统和装置。 定时子系统为标签提供系统振荡器或时钟。 定时子系统还提供由标签的RF接口使用的频率以产生反向散射调制符号。 定时子系统还提供振荡器校准。 标签接收读取器发送的一个或多个振荡器校准波形。 标签中的定时子系统使用振荡器校准波形将标签振荡器的频率连续调整到读取器所需的频率。 因此，读取器可以根据特定应用增加或减少标签中的振荡器频率。 此外，读取器可以使用一个或多个振荡器校准波形的单个传输来调整标签群中的所有标签的振荡器频率。

公开(公告)号：US20020149482A1

公开(公告)日：2002-10-17

申请号：US10072985

申请日：2002-02-12

申请人： Matrics, Inc.

发明人： Wayne E. Shanks ,  William R. Bandy ,  Michael R. Arneson ,  Kevin J. Powell

IPC分类号： G08B013/14

CPC分类号： G06K19/07749 ,  G06K7/0008 ,  G06K7/10039 ,  G06K7/10069 ,  G06K7/10108 ,  G06K7/10356 ,  G06K17/00 ,  G06K19/0713 ,  G06K19/0723 ,  G06K19/07767 ,  G08B13/2485 ,  G11C5/142 ,  H04L7/0331

摘要： An identification (ID) tag includes a substrate having an input capable of receiving a high frequency signal. For instance, the high frequency signal can be a radio frequency (RF) signal that is generated as part of a radio frequency (RF) ID system. A first charge pump is coupled to the input and is configured to convert the high frequency signal to a substantially direct current (DC) voltage. A data recovery circuit is coupled to the input and is capable of recovering data from the high frequency signal. A back scatter switch is coupled to the input and is capable of modifying an impedance of the input, responsive to a control signal. A state machine is disposed on the substrate and is responsive to the data recovered by the second charge pump, where the state machine is capable of generating the control signal for the back scatter switch in response to the data. The DC voltage from the first charge pump is capable of providing a voltage supply for at least one of the data recovery circuit, the back scatter switch, and the state machine. The data recovery circuit includes a second charge pump that is capable of operating on the high frequency signal simultaneously with the first charge pump. In other words, the first charge pump can generate the supply voltage for the ID tag from the high frequency signal, while the second charge pump simultaneously retrieves the data from the high frequency signal. The first charge pump also includes a means for limiting the amplitude of the DC voltage by reducing the charge pump efficiency, once a threshold voltage is reached.

摘要翻译： 识别（ID）标签包括具有能够接收高频信号的输入的基板。 例如，高频信号可以是作为射频（RF）ID系统的一部分而生成的射频（RF）信号。 第一电荷泵耦合到输入端并被配置为将高频信号转换成基本上直流（DC）的电压。 数据恢复电路耦合到输入端并且能够从高频信号中恢复数据。 背散射开关耦合到输入端，并且能够响应于控制信号来修改输入的阻抗。 状态机设置在基板上并且响应于由第二电荷泵恢复的数据，其中状态机能够响应于数据而产生用于背散射开关的控制信号。 来自第一电荷泵的DC电压能够为数据恢复电路，后向散射开关和状态机中的至少一个提供电压源。 数据恢复电路包括能够与第一电荷泵同时对高频信号进行操作的第二电荷泵。 换句话说，第一电荷泵可以从高频信号产生ID标签的电源电压，而第二电荷泵同时从高频信号中检索数据。 第一电荷泵还包括一旦达到阈值电压，则通过降低电荷泵效率来限制直流电压的振幅的装置。