发明申请
US20040256240A1 System and process to control electroplating a metal onto a substrate
审中-公开
用于控制将金属电镀到衬底上的系统和工艺
- 专利标题： System and process to control electroplating a metal onto a substrate
- 专利标题（中）： 用于控制将金属电镀到衬底上的系统和工艺
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申请号： US10465666申请日： 2003-06-20
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公开(公告)号： US20040256240A1公开(公告)日： 2004-12-23
- 发明人: David C. Nelsen , Rajiv Rastogi
- 主分类号： C25D005/00
- IPC分类号： C25D005/00 ; C25D017/16 ; C25D017/00
摘要：
An electroplating system is provided with a rotatable head assembly including a substrate holder to secure a substrate for entry into a bath of electrolyte; and a head tilt mechanism including a stepper motor connected to the rotatable head assembly and configured to control bath entry parameters for optimal surface wetting of the substrate, upon bath entry for electroplating the substrate free of electroplating defects, including, but not limited to, swirl defects.
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