公开(公告)号：US20040265488A1

公开(公告)日：2004-12-30

申请号：US10611745

申请日：2003-06-30

申请人： General Electric Company

发明人： Canan Uslu Hardwicke ,  Ronald Scott Bunker

IPC分类号： B05D001/12 ,  C25D005/00 ,  C23C014/00

CPC分类号： F01D5/288 ,  C23C4/123 ,  C23C26/02 ,  C23C30/00 ,  F01D5/186 ,  F01D9/065 ,  F05D2230/90 ,  F05D2240/11 ,  F05D2240/81 ,  F05D2250/21 ,  F05D2250/23 ,  F05D2260/202 ,  F05D2300/611 ,  Y02T50/67 ,  Y02T50/672 ,  Y02T50/676

摘要： A method for forming a flow director on a component having a wall includes depositing at least one layer on the wall of the component. The deposition includes shaping the layer in accordance with a predetermined shape to form the flow director. An exemplary component is a turbine component with a wall having a cold surface and a hot surface. At least one film-cooling hole extends through the wall, for flowing a coolant from the cold surface to the hot surface, and defines an exit site in the hot surface of the wall. An exemplary deposition process includes delivering a mixture through a nozzle onto the wall to form the layer, where the mixture includes a powder dispersed in a liquid medium, displacing the nozzle relative to the wall and controlling the movement of the nozzle relative to the wall to form the layer in accordance with the predetermined shape.

摘要翻译： 在具有壁的部件上形成导流器的方法包括在组件的壁上沉积至少一层。 沉积包括根据预定形状成形该层以形成导流器。 示例性部件是具有带有冷表面和热表面的壁的涡轮机部件。 至少一个薄膜冷却孔延伸穿过壁，用于将冷却剂从冷表面流动到热表面，并且在壁的热表面中限定出口部位。 示例性的沉积方法包括将混合物通过喷嘴输送到壁上以形成层，其中混合物包括分散在液体介质中的粉末，相对于壁移动喷嘴并控制喷嘴相对于壁的运动， 根据预定形状形成层。

公开(公告)号：US20040195105A1

公开(公告)日：2004-10-07

申请号：US10608678

申请日：2003-06-27

申请人： Korea Institute of Machinery and Materials

发明人： Jai-Moo Yoo ,  Young-Kuk Kim ,  Jae-Woong Ko ,  Kyu-Hwan Lee ,  Do-Yon Chang

IPC分类号： C25D005/00 ,  C25D003/56

CPC分类号： C25D3/14 ,  C25D3/562 ,  C25D5/18

摘要： Disclosed herein are a biaxially textured pure metal or alloy layer deposited by electroplating process on the surface of a single-crystalline or quasi-single-crystalline metal substrate, and a method for manufacturing the biaxially textured pure metal or alloy layer. Specifically, the biaxially textured pure metal or alloy layer is deposited by electroplating process on the surface of a pure metal or alloy substrate having single-crystalline or quasi-single-crystalline orientation. The biaxially textured pure metal or alloy layer has a misorientation on the c-axis of 4null or less and a misorientation on the plane formed by the a-axis and b-axis of 5.2null or less in which the misorientation on the c-axis is determined by a Full Width at Half Maximum of peaks on the null-rocking curve and the misorientation on the plane formed by the a-axis and b-axis is determined by a Full Width at Half Maximum of peaks on the null-scan. The biaxially textured pure metal and alloy layers can be manufactured simply by electroplating process without the need for additional processes. In addition, the biaxially textured layers fabricated according to method in the present invention exhibit excellent texture compared to those manufactured through conventional processes, and thus can be used as metal substrates for superconducting wires and thin film magnetic materials. Accordingly, they are expected to greatly contribute to the development of related industries.

摘要翻译： 本文公开了通过电镀方法在单晶或准单晶金属基板的表面上沉积的双轴织构的纯金属或合金层，以及用于制造双轴织构的纯金属或合金层的方法。 具体地说，将双轴织构的纯金属或合金层通过电镀工艺沉积在具有单晶或准单晶取向的纯金属或合金基底的表面上。 双轴织构化的纯金属或合金层在c轴上的取向差为4°以下，并且由a轴和b轴形成的平面上的定向偏差在5.2°以下，其中c- 轴由θ-摇摆曲线上的最大峰值处的全宽决定，并且由a轴和b轴形成的平面上的取向误差由Phi扫描上的最大峰值处的全宽确定 。 双轴纹理的纯金属和合金层可以简单地通过电镀工艺制造，而不需要额外的工艺。 此外，根据本发明的方法制造的双轴纹理层与通过常规方法制造的那些相比表现出优异的织构，因此可以用作超导线和薄膜磁性材料的金属基底。 因此，有望为相关产业的发展作出巨大贡献。

公开(公告)号：US20040168926A1

公开(公告)日：2004-09-02

申请号：US10744294

申请日：2003-12-22

发明人： Bulent M. Basol ,  Homayoun Talieh

IPC分类号： C25D005/00 ,  C25D005/48 ,  C25D021/10

CPC分类号： C25D5/22 ,  B23H5/06 ,  B24B37/26 ,  C25D5/02 ,  C25D5/06 ,  C25D7/123 ,  C25F7/00 ,  H01L21/2885 ,  H01L21/32125 ,  H01L21/76877

摘要： The present invention provides a method for forming a conductive film with uniform properties on a wafer surface that has features or cavities. During the process, the workpiece is rotated and laterally moved while an electrodeposition solution is delivered onto the wafer surface at a predetermined flow rate, and a potential difference is applied between the workpiece surface and the electrode. The workpiece is rotated about an axis at predetermined revolutions per minute so that an edge region of the workpiece has a first predetermined linear velocity due to the rotation. The workpiece has a second predetermined linear velocity due to the lateral motion. The second predetermined velocity may be larger than the first predetermined velocity. Further, the wafer may not be rotated.

摘要翻译： 本发明提供一种在具有特征或空穴的晶片表面上形成具有均匀性质的导电膜的方法。 在该过程中，工件被旋转并横向移动，同时电沉积溶液以预定流速输送到晶片表面上，并且在工件表面和电极之间施加电位差。 工件以预定转数每分钟绕轴线旋转，使得工件的边缘区域由于旋转而具有第一预定的线速度。 由于横向运动，工件具有第二预定的线速度。 第二预定速度可以大于第一预定速度。 此外，晶片可能不会旋转。

公开(公告)号：US20040134789A1

公开(公告)日：2004-07-15

申请号：US10742390

申请日：2003-12-22

发明人： Koji Mishima ,  Junji Kunisawa ,  Natsuki Makino ,  Norio Kimura ,  Hiroaki Inoue ,  Kenji Nakamura ,  Moriji Matsumoto ,  Takahiro Nanjo ,  Mitsuko Odagaki

IPC分类号： C25D005/00

CPC分类号： H01L21/67109 ,  C25D7/123 ,  C25D17/001 ,  H01L21/2885 ,  H01L21/67778 ,  H01L21/681

摘要： A substrate processing apparatus fills a metal such as copper or the like in fine interconnection patterns or trenches defined in a semiconductor substrate. The substrate processing apparatus has a loading/unloading unit for placing a substrate cassette to allow a substrate to be loaded and unloaded, a substrate treating unit for treating a substrate, and a transfer robot for transferring a substrate between the loading/unloading unit and the substrate treating unit. The loading/unloading unit, the substrate treating unit, and the transfer robot are installed in a single facility. The loading/unloading unit has a rotary table which is horizontally rotatable for positioning the substrate cassette in a position to detect the substrate cassette placed in the loading/unloading unit and to remove the substrate from the substrate cassette with the transfer robot.

摘要翻译： 基板处理装置以限定在半导体基板中的精细互连图案或沟槽中填充诸如铜等的金属。 基板处理装置具有用于放置基板盒以装载和卸载基板的装载/卸载单元，用于处理基板的基板处理单元，以及用于在装载/卸载单元和卸载单元之间传送基板的传送机器人 底物处理单元。 装载/卸载单元，基板处理单元和传送机器人安装在单个设施中。 装载/卸载单元具有可水平旋转的旋转台​​，用于将基板盒定位在检测装载/卸载单元中的基板盒的位置，并用传送机器人从基板盒移除基板。

公开(公告)号：US20040108212A1

公开(公告)日：2004-06-10

申请号：US10313980

申请日：2002-12-06

发明人： Lyndon Graham ,  Robert A. Weaver ,  Gregory J. Wilson ,  Kyle M. Hanson

IPC分类号： C25D005/00

CPC分类号： C23C18/1619 ,  C23C18/1678 ,  C25D5/00 ,  C25D7/123 ,  C25D17/001 ,  C25D21/02

摘要： A method and apparatus for processing a microelectronic workpiece. The apparatus can include a vessel configured to receive a processing fluid and can further include a support member having a contacting portion configured to carry the microelectronic workpiece at least proximate to the vessel. The apparatus can further include a heater positioned at least proximate to at least one of the vessel and the support member to heat at least a portion of the support member. Alternatively, the heater can be positioned to heat at least a portion of the microelectronic workpiece in addition to, or in lieu of heating the support member.

摘要翻译： 一种用于处理微电子工件的方法和装置。 该装置可以包括构造成接收处理流体的容器，并且还可以包括具有接触部分的支撑构件，该接触部分构造成将微电子工件至少靠近容器。 该设备还可以包括至少靠近容器和支撑构件中的至少一个的加热器，以加热支撑构件的至少一部分。 或者，除了加热支撑构件之外或代替加热支撑构件，加热器可以定位成加热微电子工件的至少一部分。

公开(公告)号：US20040035712A1

公开(公告)日：2004-02-26

申请号：US10228505

申请日：2002-08-26

发明人： Salman Akram ,  David R. Hembree

IPC分类号： C25D005/00 ,  C25D017/00

CPC分类号： H01L21/67086 ,  C25D5/08 ,  C25D17/001 ,  C25F7/00 ,  H01L21/67051 ,  H01L21/67057 ,  H01L21/6708

摘要： An apparatus and method for treating a substrate to deposit, clean or etch material on a substrate uses a first horizontal chuck to which a plurality of substrates is attached and electrically charged. Spaced closely to the first horizontal chuck is a coextensive horizontal second chuck which receives and showers reaction solution over all portions of each substrate. During the reaction process, both chucks are substantially submerged in reaction solution within a tank. At least one of the chucks is attached and controllable from a control arm. At least one of the chucks is rotated about a vertical axis at a slow speed during the reaction process. The axes of rotation of the two chucks may be coincident, or the axes may be offset from each other, and/or one or both axes may be offset from the chuck centerpoint(s). One of the chucks may also be periodically moved in a vertical direction relative to the other chuck.

摘要翻译： 用于处理衬底以在衬底上沉积，清洁或蚀刻材料的设备和方法使用附接有多个衬底并带电的第一水平卡盘。 与第一个水平卡盘密切相邻的是一个共同延伸的水平第二卡盘，它在每个基板的所有部分上接收和反射反应溶液。 在反应过程中，两个卡盘基本上浸没在罐内的反应溶液中。 至少一个卡盘从控制臂附接和控制。 在反应过程中，至少一个卡盘以垂直轴线以慢速旋转。 两个卡盘的旋转轴线可以重合，或者轴线可能彼此偏移，和/或一个或两个轴线可能偏离卡盘中心点。 其中一个卡盘也可以相对于另一个卡盘在垂直方向周期性地移动。

公开(公告)号：US20040020780A1

公开(公告)日：2004-02-05

申请号：US10419717

申请日：2003-04-21

发明人： H. Peter W. Hey ,  Yezdi N. Dordi

IPC分类号： C25D005/00

CPC分类号： C25D7/123 ,  C25D5/003 ,  C25D5/18 ,  C25D17/001 ,  C25D21/00 ,  H01L21/2885

摘要： A method for immersing a substrate into a processing solution. The method includes connecting a power supply between a conductive layer on the substrate and an electrode positioned in the processing solution, immersing the substrate into the processing solution, and applying an electrical bias to the conductive layer during the immersion.

摘要翻译： 一种将基材浸入处理溶液中的方法。 该方法包括将基板上的导电层和位于处理溶液中的电极之间的电源连接，将基板浸入处理溶液中，以及在浸入期间向导电层施加电偏压。

公开(公告)号：US20040016646A1

公开(公告)日：2004-01-29

申请号：US10208695

申请日：2002-07-29

发明人： Galen D. Stucky ,  Kyoung-Shin Choi ,  Eric W. McFarland

IPC分类号： C25D005/00

CPC分类号： B82Y30/00 ,  B82Y10/00 ,  C25D13/00 ,  C25D13/22

摘要： An electrochemical method for generating both mesoporous metal and metal oxide films from dilute surfactant solutions by utilizing self assembly of surfactant-inorganic aggregates in the electric field of the solid-liquid interface at an electrode to specifically direct the morphology of the film. The surface of the working electrode serves as a solid-liquid interface in a plating solution containing surfactant and inorganic ions and salts.

摘要翻译： 一种电化学方法，用于通过在电极处的固液界面的电场中利用表面活性剂 - 无机聚集体的自组装来产生来自稀表面活性剂溶液的介孔金属和金属氧化物膜，以具体指导膜的形态。 工作电极的表面用作含有表面活性剂和无机离子和盐的电镀溶液中的固 - 液界面。

公开(公告)号：US20030217928A1

公开(公告)日：2003-11-27

申请号：US10154935

申请日：2002-05-23

申请人： Battelle Memorial Institute

发明人： Yuehe Lin ,  Liang Liang ,  Jun Liu

IPC分类号： C25D005/00

CPC分类号： B82Y30/00 ,  C09D5/4476 ,  C25D9/00

摘要： A method for producing an array of oriented nanofibers that involves forming a solution that includes at least one electroactive species. An electrode substrate is brought into contact with the solution. A current density is applied to the electrode substrate that includes at least a first step of applying a first substantially constant current density for a first time period and a second step of applying a second substantially constant current density for a second time period. The first and second time periods are of sufficient duration to electrically deposit on the electrode substrate an array of oriented nanofibers produced from the electroactive species. Also disclosed are films that include arrays or networks of oriented nanofibers and a method for amperometrically detecting or measuring at least one analyte in a sample.

摘要翻译： 一种制备定向纳米纤维阵列的方法，其涉及形成包含至少一种电活性物质的溶液。 使电极基板与溶液接触。 对电极基板施加电流密度，该电极基板至少包括第一时间段施加第一基本上恒定的电流密度的第一步骤和在第二时间段施加第二基本上恒定的电流密度的第二步骤。 第一和第二时间段具有足够的持续时间以在电极基底上电沉积由电活性物质产生的定向纳米纤维阵列。 还公开了包括定向纳米纤维的阵列或网络的膜，以及用于电离量子检测或测量样品中的至少一种分析物的方法。

公开(公告)号：US20030038038A1

公开(公告)日：2003-02-27

申请号：US10201604

申请日：2002-07-22

发明人： Bulent M. Basol ,  Cyprian E. Uzoh ,  Homayoun Talieh

IPC分类号： C25D005/02 ,  H05K003/00 ,  C25D005/00 ,  C25D005/48

CPC分类号： C25D5/02 ,  C25D5/22 ,  C25D7/123 ,  H01L21/2885 ,  H01L21/7684 ,  H01L21/76877

摘要： The present invention relates to a method for forming a planar conductive surface on a wafer. In one aspect, the present invention uses a no-contact process with electrochemical deposition, followed by a contact process with electrochemical mechanical deposition.

摘要翻译： 本发明涉及一种在晶片上形成平面导电表面的方法。 一方面，本发明使用具有电化学沉积的无接触方法，接着进行电化学机械沉积的接触过程。