公开(公告)号：US20040262152A1

公开(公告)日：2004-12-30

申请号：US10900007

申请日：2004-07-27

发明人： Uziel Landau

IPC分类号： C25C003/16 ,  C25B015/00 ,  C25D017/00

CPC分类号： C25D21/12

摘要： The invention relates to the analysis of the performance and properties of electrochemical processes, and specifically, to electrolytic solutions and electrode processes. The invention discloses a device and a method for obtaining qualitative and quantitative information for the kinetics of the electrode reactions, the transport processes, the thermodynamic properties of the electrochemical processes taking place in the cell. When a deposition reaction takes place, the device provides also valuable information about the relationship between the current density and deposit properties including but not limited to the deposit color, luster, and other aspects of its appearance. The device disclosed herein typically is comprised of a multiplicity of cathodic or anodic regions where one or more electrochemical reactions take place simultaneously, but at a different rate. From the precisely measured segmental currents one can obtain among other process properties: (1) An accurate relationship between the deposit appearance and the current density. This relationship can be used for process diagnostics, troubleshooting, control of concentrations, pH, and additives and contaminants and for optimizing the operating conditions, including the voltage, current, and circulation rate. (2) Quantitative determination of important process parameters including but not limited to, kinetics (e.g., exchange current density, cathodic and anodic transfer coefficients), transport (e.g. conductivity), and thermodynamics (e.g., standard potential). A particularly attractive application of the process is for the quantitative and qualitative processes of alloys plating and for the determination of the relationship between the current efficiency and the applied current density.

公开(公告)号：US20040256240A1

公开(公告)日：2004-12-23

申请号：US10465666

申请日：2003-06-20

发明人： David C. Nelsen ,  Rajiv Rastogi

IPC分类号： C25D005/00 ,  C25D017/16 ,  C25D017/00

CPC分类号： C25D17/06 ,  C25D17/001 ,  C25D21/12

摘要： An electroplating system is provided with a rotatable head assembly including a substrate holder to secure a substrate for entry into a bath of electrolyte; and a head tilt mechanism including a stepper motor connected to the rotatable head assembly and configured to control bath entry parameters for optimal surface wetting of the substrate, upon bath entry for electroplating the substrate free of electroplating defects, including, but not limited to, swirl defects.

摘要翻译： 电镀系统设置有可旋转的头部组件，其包括衬底保持器以固定用于进入电解质浴的衬底; 以及头部倾斜机构，其包括连接到可旋转头部组件的步进电机，并且被配置为控制浴入口参数，用于在衬底进行电镀时不使用电镀缺陷进行电镀，包括但不限于旋流 缺陷

公开(公告)号：US20040256237A1

公开(公告)日：2004-12-23

申请号：US10485306

申请日：2004-08-09

发明人： Itsuki Kobata ,  Mitsuhiko Shirakashi ,  Masayuki Kumekawa ,  Takayuki Saito ,  Yasushi Toma ,  Tsukuru Suzuki ,  Kaoru Yamada ,  Yuji Makita ,  Hozumi Yasuda ,  Ikutaro Noji ,  Kunio Fujiwara ,  Osamu Nabeya

IPC分类号： C25D005/06 ,  C25B015/00 ,  C25B007/00 ,  C08F002/58 ,  B01D057/02 ,  C25D017/00

CPC分类号： B23H5/08 ,  C23F3/00 ,  C25F1/00 ,  C25F3/00 ,  C25F7/00 ,  H01L21/32115 ,  H01L21/32125 ,  H01L21/32134

摘要： There is provided an electrolytic processing apparatus and method which, while omitting a CMP treatment entirely or reducing a load upon a CMP treatment to the least possible extent, can process a conductive material formed in the surface of a substrate to flatten the material, or can remove (clean) extraneous matter adhering to the surface of a workpiece such as a substrate. The electrolytic processing apparatus includes: a pair of electrodes disposed at a given distance; an ion exchange disposed between the pair of electrodes; and a liquid supply section for supplying a liquid between the pair of electrodes. The electrolytic processing method includes: providing an electrode section having, a pair of electrodes disposed at a given distance with an ion exchanger being interposed: and bringing the electrode into contact with or close to a workpiece while supplying a fluid to the ion exchanger, thereby processing the surface of the workpiece.

摘要翻译： 提供了一种电解处理装置和方法，其可以在完全省略CMP处理或尽可能减少CMP处理时的负载的同时，处理形成在基板的表面中的导电材料以使材料变平，或者可以 去除（清洁）附着在诸如基板的工件的表面上的外来物质。 电解处理装置包括：以一定距离设置的一对电极; 设置在所述一对电极之间的离子交换器; 以及用于在一对电极之间提供液体的液体供应部分。 电解处理方法包括：提供电极部分，其具有设置有离子交换器的给定距离的一对电极，并且使电极与工件接触或接近工件，同时向离子交换器供应流体，由此 加工工件的表面。

公开(公告)号：US20040245111A1

公开(公告)日：2004-12-09

申请号：US10861059

申请日：2004-06-04

申请人： MITSUI MINING & SMELTING CO., LTD.

发明人： Akira Fujimoto

IPC分类号： C25D005/02 ,  C25D017/00 ,  H01L023/495

CPC分类号： H01L21/4821 ,  C25D5/003 ,  C25D17/001 ,  C25D21/04 ,  H01L23/4985 ,  H01L2924/0002 ,  H05K1/0393 ,  H05K3/241 ,  H05K2203/1518 ,  H05K2203/1545 ,  H01L2924/00

摘要： A plating machine for plating a film carrier tape for mounting electronic parts includes a plating tank for plating wiring patterns of a film carrier tape and also has a bubble adhesion prevention means that is position adjustable with respect to the surface of a plating solution contained in the plating tank. The process for producing film carrier tapes for mounting electronic parts comprises partially immersing a film carrier tape in a plating solution contained in a plating tank and selectively plating wiring patterns formed in the immersed area while adsorbing bubbles generated in the plating solution to a bubble adhesion prevention means arranged at the surface of the plating solution.

摘要翻译： 用于电镀用于安装电子部件的胶片载带的电镀机包括用于电镀薄膜载带的布线图形的镀槽，并且还具有气泡粘附防止装置，其相对于包含在 电镀槽。 用于安装电子部件的薄膜载带的制造方法包括将薄膜载带部分地浸渍在电镀槽中所含的电镀溶液中，并且选择性地镀覆形成在浸渍区域中的布线图案，同时将产生在电镀液中的气泡吸附到气泡粘附防止 布置在电镀液表面的装置。

公开(公告)号：US20040238350A1

公开(公告)日：2004-12-02

申请号：US10483999

申请日：2004-01-27

发明人： Yohei Takahashi ,  Kunio Fujiwara ,  Takayoshi Kawamoto ,  Syu Nakanishi ,  Toru Akiyama

IPC分类号： C25C007/00 ,  C25B009/00 ,  C25D017/00 ,  B01D015/00

CPC分类号： C08J5/20 ,  B01D61/48 ,  B01J39/05 ,  B01J41/05 ,  B01J47/08 ,  B01J47/12 ,  C02F1/42 ,  C02F1/4604 ,  C02F1/469 ,  C02F2201/46115 ,  B01J39/07 ,  B01J41/07

摘要： The present invention provides ion exchangers for an electrical deionization apparatus that can be operated at low voltages by preventing voltage buildup in the electrical deionization apparatus, and an electrical deionization apparatus incorporating said ion exchangers. The present invention provides an ion exchanger for an electrical deionization apparatus, which is to be used as an ion exchanger placed in at least one of a deionization compartment and/or concentration compartment and, which at least partially has a plurality of different functional groups, or which has a graft chain having an ion exchange group on the backbone of an organic polymer substrate and further has a second graft chain on said graft chain, or which has a crosslinked graft chain having an ion exchange group on the backbone of an organic polymer substrate.

摘要翻译： 本发明提供了一种用于去离子电离装置的离子交换器，该离子交换器可以通过防止电去离子装置中的电压累积而在低电压下运行，以及包含所述离子交换器的去离子电离装置。 本发明提供了一种用于去离子电离装置的离子交换器，其用作放置在去离子室和/或浓缩室中的至少一个中并且至少部分具有多个不同官能团的离子交换器， 或具有在有机聚合物基材的主链上具有离子交换基团的接枝链，并且在所述接枝链上还具有第二接枝链，或者在有机聚合物的主链上具有离子交换基团的交联接枝链 基质。

公开(公告)号：US20040206623A1

公开(公告)日：2004-10-21

申请号：US10826489

申请日：2004-04-16

申请人： Applied Materials, Inc.

发明人： Allen L. D'Ambra ,  Arulkumar Shanmugasundram ,  Michael X. Yang ,  Yevgeniy (Eugene) Rabinovich ,  Dmitry Lubomirsky

IPC分类号： C25D017/00

CPC分类号： C25D17/00

摘要： Embodiments of the invention generally provide a fluid delivery system for an electrochemical plating platform. The fluid delivery system is configured to supply multiple chemistries to multiple plating cells with minimal bubble formation in the fluid delivery system. The system includes a solution mixing system, a fluid distribution manifold in communication with the solution mixing system, a plurality of fluid conduits in fluid communication with the fluid distribution manifold, and a plurality of fluid tanks, each of the plurality of fluid tanks being in fluid communication with at least one of the plurality of fluid conduits.

摘要翻译： 本发明的实施方案通常提供用于电化学电镀平台的流体输送系统。 流体输送系统被配置为在流体输送系统中以最小的气泡形成向多个电镀单元提供多个化学物质。 该系统包括溶液混合系统，与溶液混合系统连通的流体分配歧管，与流体分配歧管流体连通的多个流体导管和多个流体箱，多个流体箱中的每一个处于 与多个流体导管中的至少一个流体连通。

公开(公告)号：US20040197482A1

公开(公告)日：2004-10-07

申请号：US10492523

申请日：2004-04-14

发明人： Airy-Pierre Lamaze ,  Christian Barthelemy

IPC分类号： B05D003/02 ,  C25D017/00

CPC分类号： C04B41/009 ,  C04B35/62222 ,  C04B35/634 ,  C04B41/5031 ,  C04B41/5035 ,  C04B41/5037 ,  C04B41/87 ,  C04B2111/00879 ,  C08K3/013 ,  C09D183/04 ,  C23C24/08 ,  C23C26/00 ,  C25C3/08 ,  C25C3/125 ,  C04B41/4539 ,  C04B41/455 ,  C04B41/5027 ,  C04B41/507 ,  C04B35/522

摘要： The invention concerns a coating precursor comprising a silicone resin, a metal compound and an organic solvent capable of dissolving said silicone and of suspending said metal compound, said silicone resin and said metal compound being capable of chemically reacting so as to produce a solid layer on a substrate after the organic solvent has evaporated and a cohesive refractory layer after a calcination process. The invention also concerns a method for coating a specific surface of a substrate with at least a refractory silicon-containing layer which consists in coating the substrate with a coating precursor of the invention, so as to form a raw layer and carrying out a heat treatment so as to calcine said raw layer and form a cohesive refractory layer. The invention enables to obtain a protective coating resistant to oxidizing environments, liquid metal or molten salt.

摘要翻译： 本发明涉及包含有机硅树脂，金属化合物和能够溶解所述硅氧烷并悬浮所述金属化合物的有机溶剂的涂料前体，所述有机硅树脂和所述金属化合物能够化学反应以产生固体层 有机溶剂蒸发后的底物和煅烧后的内聚难熔层。 本发明还涉及一种用至少含有耐火含硅层涂覆基材的比表面的方法，其中包括用本发明的涂层前体涂覆基材，以便形成原始层并进行热处理 以便煅烧所述原料层并形成粘结耐火层。 本发明能够获得对氧化环境，液态金属或熔盐耐受的保护涂层。

公开(公告)号：US20040159543A1

公开(公告)日：2004-08-19

申请号：US10728200

申请日：2003-12-04

发明人： Chris Boyer ,  Brad Fiebig ,  Craig Andrews ,  James Layton

IPC分类号： C25D017/00

CPC分类号： H01M8/242 ,  H01M8/0247 ,  H01M8/0267 ,  H01M8/0271 ,  H01M8/2483

摘要： An electrochemical cell component having a plate with opposing faces, seal grooves formed in each of the faces, and a plurality of holes extending through the plate between the first and second grooves with an integral sealing member formed in the grooves and holes. The seal grooves extend continuously around the perimeter of the faces and the grooves may follow any type of contiguous pattern. The component may form a frame surrounding a flow field. Bipolar plates and fluid cooled bipolar plates may comprise this electrochemical cell component. Alternatively, a seal groove may be formed in only the first face and a ridge formed in the second face of the component. The ridge may be used to form a fluid tight seal when pressed into an opposing surface of the membrane in a membrane and electrode assembly. A sealing material is contained within the seal groove.

摘要翻译： 一种电化学电池元件，具有具有相对面的板，在每个表面中形成的密封槽，以及在所述槽和孔中形成有一体的密封构件的在所述第一和第二槽之间延伸穿过所述板的多个孔。 密封槽围绕面的周边连续延伸，凹槽可以遵循任何类型的连续图案。 组件可以形成围绕流场的框架。 双极板和流体冷却的双极板可以包括该电化学电池组件。 或者，密封槽可以仅形成在第一面中，并且形成在部件的第二面中的脊部。 当在膜和电极组件中压入膜的相对表面时，脊可用于形成流体密封。 密封材料包含在密封槽内。

公开(公告)号：US20040154917A1

公开(公告)日：2004-08-12

申请号：US10473962

申请日：2003-09-30

发明人： Hirofumi Ishida

IPC分类号： C25D017/00

CPC分类号： C25D5/08 ,  C25D17/001 ,  H01L21/2885

摘要： Provided is a cup-shaped plating apparatus which can plate the whole area of a plating target surface with a uniform film thickness. In a cup-shaped plating apparatus including a placement portion of an object to be plated which is provided at an opening end of a plating tank, means for supplying a plating solution into the plating tank, a plating solution outlet port which is formed in the plating tank, a cavity portion into which the plating solution which has flown out of the outlet port flows, a plating solution discharge port within the cavity portion, and a collection tank for the plating solution discharged from the discharge port, which subjects the object to be plated to plating treatment while supplying the plating solution into the plating tank, the shape and/or opening area of the discharge port formed on the downstream side of the cavity portion can be changed. If the shape and/or opening area of the discharge port formed on the downstream side of the cavity portion can be adjusted, it is possible to suppress nonuniform plating and variations in plating on a plating target surface by adjusting the shape and/or opening area.

摘要翻译： 提供一种杯形电镀装置，其能够以均匀的膜厚度平板化电镀目标表面的整个区域。 在包括设置在电镀槽的开口端的被镀物体的放置部的杯形电镀装置中，将电镀液供给到电镀槽中的装置，形成在电镀槽中的电镀液出口 电镀槽，从出口流出的电镀液流过的空腔部分，空腔部分内的电镀液排出口，以及从排出口排出的镀液的收集槽， 在将电镀溶液供应到电镀槽中的同时进行电镀处理，可以改变形成在空腔部分的下游侧的排出口的形状和/或开口面积。 如果能够调节形成在空腔部的下游侧的排出口的形状和/或开口面积，则可以通过调整形状和/或开口面积来抑制电镀目标表面上的不均匀电镀和电镀变化 。

公开(公告)号：US20040134794A1

公开(公告)日：2004-07-15

申请号：US10686527

申请日：2003-10-16

发明人： V.S. Meenakshi Sundaram ,  Daniel Duarte ,  Michel Epiney

IPC分类号： C25D017/00 ,  C25C007/00

CPC分类号： D21C11/0057 ,  B01J23/34 ,  B01J37/0219 ,  B01J37/0225 ,  C01B17/34

摘要： A system and method for generating polysulfide includes at least one vessel for containing the pulping liquor, and at least one oxidation promoter element including an oxidation promoter adhered by a coating material to a substrate. The oxidation promoter element may be affixed within the vessel or, alternatively, movable between two or more vessels to facilitate polysulfide generation and/or recovery of the oxidation promoter in at least two vessels.

摘要翻译： 用于产生多硫化物的系统和方法包括至少一个用于容纳制浆液的容器，以及至少一个氧化促进元件，其包括通过涂料附着到基底上的氧化促进剂。 氧化促进剂元件可以固定在容器内，或者可选地在两个或更多个容器之间移动，以促进至少两个容器中的氧化促进剂的产生和/或回收。