发明申请
- 专利标题： Method and apparatus for wet-cleaning substrate
- 专利标题（中）： 湿法清洗基材的方法和装置
-
申请号： US10898366申请日： 2004-07-26
-
公开(公告)号： US20050000545A1公开(公告)日： 2005-01-06
- 发明人: Yasuhito Inagaki
- 申请人： Yasuhito Inagaki
- 优先权： JPP2000-341094 20001108; JPP2000-341093 20001108; JPP2000-341092 20001108; JPP2000-363155 20001129; JPP2000-369632 20001205
- 主分类号： H01L21/304
- IPC分类号： H01L21/304 ; B08B3/08 ; C11D7/08 ; C11D7/10 ; C11D11/00 ; H01L21/00 ; H01L21/66 ; B08B7/04 ; B08B3/00
摘要：
In the art of wet-cleaning a substrate by etching with a cleaning solution prepared by dissolving hydrofluoric acid as an active component in water, using the process of measuring the concentration of a predetermined component regularly and then replenishing the cleaning solution with a component for correcting the concentration at need on the basis of the result of measurement on the concentration in case of cleaning the substrate with an aqueous solution of ammonium fluoride as the cleaning solution while controlling air in a cleaning draft at an exhaust rate within a predetermined range.
公开/授权文献
- US06938626B2 Method and apparatus for wet-cleaning substrate 公开/授权日：2005-09-06