发明申请
- 专利标题： Method of testing printed circuit board opening spacings
- 专利标题（中）： 测试印刷电路板开口间距的方法
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申请号： US10616932申请日： 2003-07-11
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公开(公告)号： US20050005438A1公开(公告)日： 2005-01-13
- 发明人: John Durkot
- 申请人： John Durkot
- 申请人地址： US NY Endicott
- 专利权人： Endicott Interconnect Technologies, Inc.
- 当前专利权人： Endicott Interconnect Technologies, Inc.
- 当前专利权人地址： US NY Endicott
- 主分类号： G01R23/04
- IPC分类号： G01R23/04 ; G01R31/28 ; H05K1/02 ; H05K3/00 ; H05K3/46
摘要：
A method for testing opening patterns in an active area of a PCB wherein two arrays of test patterns of apertured pads are analyzed following drilling therethrough in accordance with a specified manner. Specifically, the outer patterns are first tested and if failure results in one or more of said patterns, an inner array of patterns closer to the active area are then tested and, significantly, only the respective test pattern nearest the associated array of openings is used to determine whether said array of openings meets the designated spacing criteria.
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