Invention Application
- Patent Title: Micromechanical apparatus, pressure sensor, and method
- Patent Title (中): 微机械装置，压力传感器和方法
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Application No.: US10853793Application Date: 2004-05-25
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Publication No.: US20050016288A1Publication Date: 2005-01-27
- Inventor: Joerg Muchow , Andreas Junger , Hubert Benzel , Juergen Nitsche , Frank Schaefer , Andreas Duell , Heinz-Georg Vossenberg , Christoph Schelling
- Applicant: Joerg Muchow , Andreas Junger , Hubert Benzel , Juergen Nitsche , Frank Schaefer , Andreas Duell , Heinz-Georg Vossenberg , Christoph Schelling
- Priority: DE10323559.0 20030526
- Main IPC: B81B3/00
- IPC: B81B3/00 ; B81C1/00 ; G01L9/00
Abstract:
A micromechanical apparatus, a pressure sensor, and a method, a closed cavity being provided beneath a membrane, the membrane having a greater thickness in a first membrane region than in a second membrane region.
Public/Granted literature
- US5366318B1 Sump assembly Public/Granted day:1998-03-10
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