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    Pressure sensor for contactless pressure measurement, micromechanical pressure switch, and micromechanical pressure change sensor
    1.
    发明申请
    Pressure sensor for contactless pressure measurement, micromechanical pressure switch, and micromechanical pressure change sensor 审中-公开
    用于非接触压力测量的压力传感器，微机械压力开关和微机械压力变化传感器

    公开(公告)号：US20050028598A1

    公开(公告)日：2005-02-10

    申请号：US10802521

    申请日：2004-03-17

    申请人： Heinz-Georg Vossenberg

    发明人： Heinz-Georg Vossenberg

    IPC分类号： G01L17/00 ,  H01H1/00 ,  H01H35/24 ,  B60C23/02

    CPC分类号： H01H35/24 ,  G01L17/00 ,  H01H1/0036

    摘要： A pressure sensor for contactless pressure measurement, in particular of gas pressures, having a pressure switch which is switched on or off as a function of the prevailing pressure. An in particular robust and long-lasting pressure sensor may be implemented when an LC circuit connected to the pressure switch is provided which is opened or closed as a function of the prevailing pressure.

    摘要翻译： 用于非接触式压力测量的压力传感器，特别是气体压力，其具有作为当前压力的函数被打开或关闭的压力开关。 当提供连接到压力开关的LC电路作为主要压力的函数打开或关闭时，可以实现特别坚固和持久的压力传感器。

    Combined absolute-pressure and relative-pressure sensor
    3.
    发明授权
    Combined absolute-pressure and relative-pressure sensor 失效
    组合绝对压力和相对压力传感器

    公开(公告)号：US07270011B2

    公开(公告)日：2007-09-18

    申请号：US11110103

    申请日：2005-04-19

    申请人： Heinz-Georg Vossenberg

    发明人： Heinz-Georg Vossenberg

    IPC分类号： G01L9/00

    CPC分类号： G01L9/0054 ,  G01L9/0042 ,  G01L9/0073

    摘要： A micromechanical sensor for measuring at least a first pressure of a first medium, as well as a method for manufacturing such a micromechanical sensor. The micromechanical sensor has at least one substrate having at least two sensor elements, which are preferably made of a semiconductive material. The substrate has at least a first sensor element for measuring an absolute-pressure variable of the first medium and a second sensor element for measuring a relative-pressure variable of the first medium.

    摘要翻译： 一种用于测量第一介质的至少第一压力的微机械传感器以及用于制造这种微机械传感器的方法。 微机械传感器具有至少一个具有至少两个传感器元件的基板，其优选由半导体材料制成。 衬底具有用于测量第一介质的绝对压力变量的第一传感器元件和用于测量第一介质的相对压力变量的第二传感器元件。

    Combined absolute-pressure and relative-pressure sensor
    6.
    发明申请
    Combined absolute-pressure and relative-pressure sensor 失效
    组合绝对压力和相对压力传感器

    公开(公告)号：US20050241400A1

    公开(公告)日：2005-11-03

    申请号：US11110103

    申请日：2005-04-19

    申请人： Heinz-Georg Vossenberg

    发明人： Heinz-Georg Vossenberg

    IPC分类号： G01L9/00 ,  G01L13/02 ,  G01L13/06 ,  H01L29/84 ,  G01L11/00

    CPC分类号： G01L9/0054 ,  G01L9/0042 ,  G01L9/0073

    摘要： A micromechanical sensor for measuring at least a first pressure of a first medium, as well as a method for manufacturing such a micromechanical sensor. The micromechanical sensor has at least one substrate having at least two sensor elements, which are preferably made of a semiconductive material. The substrate has at least a first sensor element for measuring an absolute-pressure variable of the first medium and a second sensor element for measuring a relative-pressure variable of the first medium.

    摘要翻译： 一种用于测量第一介质的至少第一压力的微机械传感器以及用于制造这种微机械传感器的方法。 微机械传感器具有至少一个具有至少两个传感器元件的基板，其优选由半导体材料制成。 衬底具有用于测量第一介质的绝对压力变量的第一传感器元件和用于测量第一介质的相对压力变量的第二传感器元件。

    Micromechanical component and appropriate manufacturing method
    7.
    发明授权
    Micromechanical component and appropriate manufacturing method 有权
    微机械部件和适​​当的制造方法

    公开(公告)号：US06395574B2

    公开(公告)日：2002-05-28

    申请号：US09858805

    申请日：2001-05-16

    申请人： Hubert Benzel ,  Frank Schaefer ,  Heinz-Georg Vossenberg

    发明人： Hubert Benzel ,  Frank Schaefer ,  Heinz-Georg Vossenberg

    IPC分类号： H01L2100

    CPC分类号： B81B3/001 ,  B81B2201/0264 ,  G01L9/0042 ,  G01L9/0054

    摘要： A micromechanical component, particularly a pressure sensor, includes a substrate, made of semiconductor material; a functional layer provided epitactically on substrate; a hollow space being provided between substrate and functional layer defining a diaphragm region of functional layer; and below diaphragm region, on substrate, one or more spacers being provided, for preventing adhesion of diaphragm region to substrate during deformation. Also described is an appropriate manufacturing method.

    摘要翻译： 微机械部件，特别是压力传感器，包括由半导体材料制成的基板; 在衬底上外延地设置的功能层; 设置在限定功能层的膜片区域的基板和功能层之间的中空空间; 并且在隔膜区域的下方，在基板上设置一个或多个间隔件，用于防止在变形期间膜片区域与基板的粘附。 还描述了适当的制造方法。

    Method for fabricating a micromechanical component
    8.
    发明授权
    Method for fabricating a micromechanical component 有权
    微机械部件的制造方法

    公开(公告)号：US06268232B1

    公开(公告)日：2001-07-31

    申请号：US09302224

    申请日：1999-04-29

    申请人： Helmut Skapa ,  Horst Muenzel ,  Franz Laermer ,  Michael Offenberg ,  Heinz-Georg Vossenberg

    发明人： Helmut Skapa ,  Horst Muenzel ,  Franz Laermer ,  Michael Offenberg ,  Heinz-Georg Vossenberg

    IPC分类号： H01L2100

    CPC分类号： G01P15/0802 ,  B81B2201/0235 ,  B81C1/00571 ,  B81C2201/0109 ,  B81C2201/014 ,  B81C2201/056 ,  B81C2203/0109 ,  G01P1/023

    摘要： A method for fabricating a micromechanical component, in particular a surface-micromechanical acceleration sensor, involves preparing a substrate and providing an insulation layer on the substrate, in which a patterned circuit trace layer is buried. A conductive layer, including a first region and a second region, is provided on the insulation layer, and a movable element is configured in the first region by forming a first plurality of trenches and by using an etching agent to remove at least one portion of the insulation layer from underneath the conductive layer. A contact element is formed and electrically connected to the circuit trace layer in the second region by configuring a second plurality of trenches, and the resultant movable element is encapsulated in the first region. The second plurality of trenches for forming the contact element in the second region is first formed after the encapsulation of the movable element formed in the first region.

    摘要翻译： 用于制造微机械部件，特别是表面微机械加速度传感器的方法涉及准备衬底并在衬底上提供绝缘层，其中掩埋有图案化的电路迹线层。 包括第一区域和第二区域的导电层设置在绝缘层上，并且可移动元件通过形成第一多个沟槽而被构造在第一区域中，并且通过使用蚀刻剂去除至少一部分 绝缘层从导电层下面。 通过构造第二多个沟槽，形成接触元件并在第二区域中电连接到电路迹线层，并且所得到的可移动元件被封装在第一区域中。 在第二区域中形成接触元件的第二多个沟槽首先在形成在第一区域中的可移动元件的封装之后形成。

    Micromechanical component
    9.
    发明授权
    Micromechanical component 有权
    微机械部件

    公开(公告)号：US06272926B1

    公开(公告)日：2001-08-14

    申请号：US09293233

    申请日：1999-04-16

    申请人： Michael Fehrenbach ,  Dietrich Schubert ,  Heinz-Georg Vossenberg

    发明人： Michael Fehrenbach ,  Dietrich Schubert ,  Heinz-Georg Vossenberg

    IPC分类号： G01P15125

    CPC分类号： B81B3/0051 ,  B81B2201/0235 ,  G01P15/0802 ,  G01P15/125 ,  G01P2015/0814

    摘要： A micromechanical component, in particular an acceleration sensor, includes a substrate, at least one spring element and at least one seismic mass. The spring element is joined at a first end to the substrate and at a second end to the mass, and the rigidity of the spring element is set such that a movement of the mass relative to the substrate can be caused by an acceleration parallel to a surface of the substrate. For the spring element, provision is made for a spring limit stop which limits a deformation of the spring element in response to an acceleration parallel to the surface of the substrate.

    摘要翻译： 微机械部件，特别是加速度传感器包括基板，至少一个弹簧元件和至少一个地震块。 弹簧元件在第一端连接到基板，并且在第二端连接到质量块，并且弹簧元件的刚度被设定为使得质量块相对于基板的运动可以由与 基板的表面。 对于弹簧元件，设置弹簧极限挡块，其限制弹簧元件响应于平行于衬底的表面的加速度的变形。