发明申请
US20050016764A1 Wiring substrate for intermediate connection and multi-layered wiring board and their production
审中-公开
用于中间连接和多层布线板的接线基板及其生产
- 专利标题： Wiring substrate for intermediate connection and multi-layered wiring board and their production
- 专利标题（中）： 用于中间连接和多层布线板的接线基板及其生产
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申请号： US10897087申请日： 2004-07-23
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公开(公告)号： US20050016764A1公开(公告)日： 2005-01-27
- 发明人: Fumio Echigo , Kumiko Hirayama , Yoji Ueda , Yasuhiro Nakatani
- 申请人： Fumio Echigo , Kumiko Hirayama , Yoji Ueda , Yasuhiro Nakatani
- 优先权： JPP2003-279719 20030725
- 主分类号： H05K1/11
- IPC分类号： H05K1/11 ; H05K1/02 ; H05K3/00 ; H05K3/20 ; H05K3/40 ; H05K3/46 ; H05K3/36
摘要：
There is provided a wiring substrate for intermediate connection comprising: (1) a wiring board having a plurality of wiring layers which are connected through a via hole conductor(s) with each other; and (2) a prepreg sheet having a via hole conductor(s) at a predetermined position(s) which sheet is disposed on at least one side of the wiring board.
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