公开(公告)号：US20050016764A1

公开(公告)日：2005-01-27

申请号：US10897087

申请日：2004-07-23

申请人： Fumio Echigo ,  Kumiko Hirayama ,  Yoji Ueda ,  Yasuhiro Nakatani

发明人： Fumio Echigo ,  Kumiko Hirayama ,  Yoji Ueda ,  Yasuhiro Nakatani

IPC分类号： H05K1/11 ,  H05K1/02 ,  H05K3/00 ,  H05K3/20 ,  H05K3/40 ,  H05K3/46 ,  H05K3/36

CPC分类号： H05K3/4614 ,  H05K3/20 ,  H05K3/4069 ,  H05K3/4602 ,  H05K3/462 ,  H05K3/4623 ,  H05K3/4652 ,  H05K3/4658 ,  H05K3/4691 ,  H05K2201/0278 ,  H05K2201/10378 ,  H05K2203/0191 ,  H05K2203/061 ,  Y10T29/49126

摘要： There is provided a wiring substrate for intermediate connection comprising: (1) a wiring board having a plurality of wiring layers which are connected through a via hole conductor(s) with each other; and (2) a prepreg sheet having a via hole conductor(s) at a predetermined position(s) which sheet is disposed on at least one side of the wiring board.

摘要翻译： 提供了一种用于中间连接的布线基板，包括：（1）布线板，具有通过通孔导体彼此连接的多个布线层; 和（2）在预定位置具有通孔导体的预浸料片，该片位于布线板的至少一侧。