发明申请
- 专利标题： Reverse pulse plating composition and method
- 专利标题（中）： 反向脉冲电镀组成及方法
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申请号： US10741908申请日： 2003-12-19
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公开(公告)号： US20050016858A1公开(公告)日： 2005-01-27
- 发明人: Leon Barstad , Thomas Buckley , Raymond Cruz , Trevor Goodrich , Gary Hamm , Mark Kapeckas , Katie Price , Erik Reddington , Wade Sonnenberg
- 申请人： Leon Barstad , Thomas Buckley , Raymond Cruz , Trevor Goodrich , Gary Hamm , Mark Kapeckas , Katie Price , Erik Reddington , Wade Sonnenberg
- 申请人地址： US MA Marlborough
- 专利权人： Shipley Company, L.L.C.
- 当前专利权人： Shipley Company, L.L.C.
- 当前专利权人地址： US MA Marlborough
- 主分类号： C25D3/02
- IPC分类号： C25D3/02 ; C25D3/38 ; C25D5/18 ; C25D7/00
摘要：
A composition and method for electroplating a metal on a substrate. The composition has a chloride to brightener concentration ratio of from 20:1 to 125:1. The method of electroplating, which employs the composition, employs pulse patterns that improve physical properties of metal surfaces.
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