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Invention Application
US20050018977A1 Optoelectronic module with transmitter chip and connecting piece for the module with respect to an optical fiber and with respect to a circuit board, and methods for producing the same 有权
具有变送器芯片的光电模块和相对于光纤相对于电路板的模块的连接件及其制造方法

  • Patent Title: Optoelectronic module with transmitter chip and connecting piece for the module with respect to an optical fiber and with respect to a circuit board, and methods for producing the same
  • Patent Title (中): 具有变送器芯片的光电模块和相对于光纤相对于电路板的模块的连接件及其制造方法
  • Application No.: US10890258
    Application Date: 2004-07-14
  • Publication No.: US20050018977A1
    Publication Date: 2005-01-27
  • Inventor: Gottfried Beer , Nikolaus Schunk
  • Applicant: Gottfried Beer , Nikolaus Schunk
  • Priority: DE10332015.6 20030714
  • Main IPC: G02B6/42
  • IPC: G02B6/42 ;  G02B6/36
Optoelectronic module with transmitter chip and connecting piece for the module with respect to an optical fiber and with respect to a circuit board, and methods for producing the same
Abstract:
An optoelectronic module and a connecting piece for the module with respect to an optical fiber and with respect to a circuit board can have a semiconductor chip in the form of an optical transmitter chip, which has a light-wave-emitting top side and has a rear side contact as a cathode on its rear side. Further semiconductor chips are embedded in a plastics composition with the optical transmitter chip in such a way that a coplanar overall top side is formed from the plastics composition and the active top side.
Abstract(Chinese):

相对于光纤并相对于电路板的光电模块和用于模块的连接件可以具有光发射器芯片形式的半导体芯片，该发射器芯片具有发光的顶侧，并且具有 后侧接触件作为其后侧的阴极。 另外的半导体芯片以这样的方式嵌入到具有光发射机芯片的塑料组合物中，使得由塑料组合物和有源顶侧形成共面整体顶侧。

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