摘要:
An optoelectronic transmitting and/or receiving module and an optical plug include a circuit carrier disposed at least partially in an alignment parallel to the optical axis of the module in a module housing. The circuit carrier forms a tongue-shaped region that protrudes into the continuation. A transmitting device and/or a receiving device is disposed in the continuation, where they are connected to the circuit carrier. The associated axial offsetting of the transmitting device and/or receiving device in the direction of an optical plug to be coupled on permits the provision of plug-in connections with improved protection of the devices and the fiber ends.
摘要:
An opto-electronic transceiver having: a transmitting component for converting electrical signals into optical signals; a first circuitry module for the transmitting component; a receiving component for converting optical signals into electrical signals; a second circuitry module for the receiving component; a printed circuitboard with conductor tracks, on which the transmitting component, the receiving component, the first circuitry module and the second circuitry module are arranged; and a transceiver housing including a nonconductive material and has a connector receptacle for receiving and coupling an optical connector. The transmitting component, the first circuitry module, the receiving component and the second circuitry module form at least one subassembly, the subassembly having: an encapsulation composition, in which the components of the subassembly are embedded, and a wiring layer embodied using thin-film technology, the wiring layer providing an electrical contact connection between the subassembly components and to associated contacts of the printed circuit board.
摘要:
A method for producing an optical or electronic module provided with a plastic package including: providing at least one optical or electronic component, the component having an operative region, via which it is in operative connection with the surroundings in the finished module, encapsulating the component with at least one polymer compound to form the plastic package, before or after the encapsulation, ascertaining the position of the component by direct measurement of the position of the component, aligning the component with respect to a device for partially removing the polymer compound or alignment of such a device with respect to the component, the alignment taking place with allowance for the ascertained position of the component, and partial removal of the polymer compound from the outside such that the polymer compound between the operative region and the outer side of the plastic package is at least partially removed.
摘要:
An opto-electronic transceiver having: a transmitting component for converting electrical signals into optical signals; a first circuitry module for the transmitting component; a receiving component for converting optical signals into electrical signals; a second circuitry module for the receiving component; a printed circuitboard with conductor tracks, on which the transmitting component, the receiving component, the first circuitry module and the second circuitry module are arranged; and a transceiver housing including a nonconductive material and has a connector receptacle for receiving and coupling an optical connector. The transmitting component, the first circuitry module, the receiving component and the second circuitry module form at least one subassembly, the subassembly having: an encapsulation composition, in which the components of the subassembly are embedded, and a wiring layer embodied using thin-film technology, the wiring layer providing an electrical contact connection between the subassembly components and to associated contacts of the printed circuit board.
摘要:
One or more aspects of the invention relate to an optical or electronic module with at least one optical or electronic component and a plastic package within which the component is embedded. The component has an operative region that facilitates operative connection with surroundings. The plastic package has a first region, which comprises a transparent polymer compound, and a second region, which comprises a non-transparent polymer compound. The first region extends such that it borders the operative region of the component.
摘要:
An optoelectronic module and a connecting piece for the module with respect to an optical fiber and with respect to a circuit board can have a semiconductor chip in the form of an optical transmitter chip, which has a light-wave-emitting top side and has a rear side contact as a cathode on its rear side. Further semiconductor chips are embedded in a plastics composition with the optical transmitter chip in such a way that a coplanar overall top side is formed from the plastics composition and the active top side.
摘要:
An optoelectronic module includes a transmitting and/or receiving element, a support on which the transmitting and/or receiving element is disposed, and a module housing having an opening for introducing the support and a coupling region for the coupling attachment of a component to be coupled on. The module housing is filled with a molding of a translucent, moldable material. A separate coupling lens for coupling light between the transmitting and/or receiving element and the component to be coupled on is provided, which lens is disposed adjacent to the molding in or just before the coupling region in the module housing. The invention also relates to several methods for producing such a module.
摘要:
A transmission and reception configuration for bi-directional optical data transmission, in particular, through plastic-fiber optical waveguides, includes a transmitter and a receiver, a coupling lens projecting light, delivered through an optical waveguide, onto the receiver, and a micro-lens, mounted on the transmitter, which focuses forward emitted light of the transmitter and projects it onto an edge region of the coupling lens, from which it is injected into the optical waveguide. The receiver and the transmitter are disposed next to one another on a substrate.
摘要:
An optical switch, in which optical input signals are fed together with pumping light to input waveguides. Output waveguides and/or conducting waveguides connected downstream thereof are doped with a dopant which effects amplification of the signal light. A wavelength-selective coupling element is arranged on the output side for the purpose of coupling out the pumping light. This improves signal quality, since the interfering pumping light is virtually no longer present downstream of the wavelength-selective coupling element.
摘要:
An optoelectronic module and a connecting piece for the module with respect to an optical fiber and with respect to a circuit board can have a semiconductor chip in the form of an optical transmitter chip, which has a light-wave-emitting top side and has a rear side contact as a cathode on its rear side. Further semiconductor chips are embedded in a plastics composition with the optical transmitter chip in such a way that a coplanar overall top side is formed from the plastics composition and the active top side.