发明申请
- 专利标题： Plating method
- 专利标题（中）： 电镀方法
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申请号： US10852706申请日： 2004-05-24
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公开(公告)号： US20050020068A1公开(公告)日： 2005-01-27
- 发明人: Deyan Wang , Robert Mikkola
- 申请人： Deyan Wang , Robert Mikkola
- 申请人地址： US MA Marlborough
- 专利权人： Rohm and Haas Electronic Materials, L.L.C.
- 当前专利权人： Rohm and Haas Electronic Materials, L.L.C.
- 当前专利权人地址： US MA Marlborough
- 主分类号： C25D3/38
- IPC分类号： C25D3/38 ; C25D5/54 ; C25D7/12 ; H01L21/288 ; H01L21/44 ; H01L21/768
摘要：
Compositions suitable for electroplating copper including one or more sources of copper, one or more alkanolamines or polymeric amines; and water are provided. These compositions are useful in the deposition and repair of seed layers used in the manufacture of electronic devices. Methods using these compositions are also provided.
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