Invention Application
- Patent Title: Etching method used in fabrications of microstructures
- Patent Title (中): 用于微结构制造中的蚀刻方法
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Application No.: US10666002Application Date: 2003-09-17
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Publication No.: US20050020089A1Publication Date: 2005-01-27
- Inventor: Hongqin Shi , Gregory Schaadt , Andrew Huibers , Satyadev Patel
- Applicant: Hongqin Shi , Gregory Schaadt , Andrew Huibers , Satyadev Patel
- Main IPC: G02B26/08
- IPC: G02B26/08 ; H01L21/00 ; H01L21/302 ; H01L21/461
Abstract:
The present invention discloses a method and apparatus for removing the sacrificial materials in fabrications of microstructures using a vapor phase etchant recipe having a spontaneous vapor phase chemical etchant. The vapor phase etchant recipe has a mean-free-path corresponding to the minimum thickness of the sacrificial layers between the structural layers of the microstructure. This method is of particular importance in removing the sacrificial layers underneath the structural layers of the microstructure.
Public/Granted literature
- US07027200B2 Etching method used in fabrications of microstructures Public/Granted day:2006-04-11
Information query
