Invention Application
US20050023931A1 Support and decoupling structure for an acoustic resonator, acoustic resonator and corresponding integrated circuit 审中-公开
声谐振器,声谐振器和相应的集成电路的支持和去耦结构

Support and decoupling structure for an acoustic resonator, acoustic resonator and corresponding integrated circuit
Abstract:
An acoustic resonator assembly includes a layer of high-acoustic-impedance material and a layer of low-acoustic-impedance material made of a low-electrical-permittivity material. This assembly may support the resonator over an interconnect layer or act as a decoupling assembly between two active elements of the resonator. The assembly may alternatively include three low-acoustic impedance layers. Alternatively, the assembly may include three acoustic impedance layers wherein two of the layers are low acoustic impedance layers and the third layer has a higher acoustic impedance than the first two or alternatively is a high-acoustic impedance layer.
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