Invention Application
- Patent Title: Submount for a photonic integrated circuit (PIC) chip
- Patent Title (中): 用于光子集成电路（PIC）芯片的基座
-
Application No.: US10852988Application Date: 2004-05-25
-
Publication No.: US20050025409A1Publication Date: 2005-02-03
- Inventor: David Welch , Vincent Dominic , Fred Kish , Mark Missey , Radhakrishnan Nagarajan , Atul Mathur , Frank Peters , Robert Taylor , Matthew Mitchell , Alan Nilsson , Stephen Grubb , Richard Schneider , Charles Joyner , Jonas Webjorn , Ting-Kuang Chiang , Robert Grencavich , Vinh Nguyen , Donald Pavinski , Marco Sosa
- Applicant: David Welch , Vincent Dominic , Fred Kish , Mark Missey , Radhakrishnan Nagarajan , Atul Mathur , Frank Peters , Robert Taylor , Matthew Mitchell , Alan Nilsson , Stephen Grubb , Richard Schneider , Charles Joyner , Jonas Webjorn , Ting-Kuang Chiang , Robert Grencavich , Vinh Nguyen , Donald Pavinski , Marco Sosa
- Applicant Address: US CA Sunnyvale
- Assignee: Infinera Corporation
- Current Assignee: Infinera Corporation
- Current Assignee Address: US CA Sunnyvale
- Main IPC: G02B6/12
- IPC: G02B6/12 ; G02B6/34 ; G02F1/017 ; H01L31/12 ; H01S3/00 ; H01S3/13 ; H01S5/00 ; H01S5/026 ; H01S5/0625 ; H01S5/0683 ; H01S5/12 ; H01S5/20 ; H01S5/22 ; H01S5/34 ; H01S5/40 ; H01S5/50 ; H04B10/00 ; H04B10/04 ; H04B10/145 ; H04B10/17 ; H04J14/02
Abstract:
A photonic integrated circuit (PIC) chip with a plurality of electro-optic components formed on a major surface of the chip and a submount that includes a substrate that extends over the major surface of the chip forming an air gap between the substrate and the major surface, the substrate to support electrical leads for electrical connection to some of the electro-optic components on the chip major surface.
Public/Granted literature
- US07062114B2 Submount for a photonic integrated circuit (PIC) chip Public/Granted day:2006-06-13
Information query
