Invention Application
- Patent Title: Microfluidics packages and methods of using same
- Patent Title (中): 微流体包装及使用方法
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Application No.: US10631478Application Date: 2003-07-31
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Publication No.: US20050026300A1Publication Date: 2005-02-03
- Inventor: Victor Samper , Lin Cong , Hongmiao Ji
- Applicant: Victor Samper , Lin Cong , Hongmiao Ji
- Applicant Address: SG Singapore SG Crescent
- Assignee: Agency for Science, Technology and Research,National University of Singapore
- Current Assignee: Agency for Science, Technology and Research,National University of Singapore
- Current Assignee Address: SG Singapore SG Crescent
- Main IPC: B01L3/00
- IPC: B01L3/00 ; G01N1/10
Abstract:
Microfluidics packages and methods of use are described, comprising in one embodiment a substrate having a top surface and means to lower pressure on the top surface; a fluidics card having a bottom surface and means to allow fluids to traverse through the card; and a polymeric barrier film, the polymeric barrier film positioned between the top surface of the substrate and the bottom surface of the fluidics card.
Public/Granted literature
- US07357898B2 Microfluidics packages and methods of using same Public/Granted day:2008-04-15
Information query
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